摘要：【中文】本发明公开了一种前置后音腔MEMS MIC，在保持外形结构不变的情况下，通过在PCB上添加腔体板形成与后音腔连通的扩大后音腔，改变MEMS MIC内部结构，从根本上解决了前进式MEMS MIC后音腔小的行业通病，使MIC内部空间利用率最大化，后音腔体积最大化，彻底消除的传统上后音腔容积完全依赖MEMS声压传感器芯片大小的问题，可以有效改善后音腔容积过小、前后音腔容积不匹配这一现状，加大的后音腔体积使MEMS芯片振幅增大，拾音灵敏度显著提升，从而在保持外形结构、整体体积不变的情况下显著改善产品灵敏度，产品语音清晰，自然，易于辨识，使产品音质显著提升。 【EN】The invention discloses a front rear sound cavity MEMS MIC, which fundamentally solves the common problem of small industry of a front-going MEMS MIC rear sound cavity by adding a cavity plate on a PCB to form an enlarged rear sound cavity communicated with the rear sound cavity under the condition of keeping the appearance structure unchanged, maximizes the utilization rate of an internal space of the MIC and the volume of the rear sound cavity, and thoroughly eliminates the problem that the volume of the rear sound cavity is completely dependent on the size of an MEMS sound pressure sensor chip in the prior art.