摘要：【中文】本发明公开了一种满足焊盘位置高精度要求的印制电路板的制作方法，包括以下步骤：(1)采用丝网印刷法印刷印制电路板的焊盘，然后进行UV固化处理；(2)采用丝网印刷法在步骤(1)得到的印制电路板上印刷线路图形，然后进行UV固化处理；(3)对步骤(2)得到的印制电路板进行蚀刻、油墨剥离处理；(4)采用丝网印刷法在步骤(3)得到的印制电路板的表面印刷阻焊油墨，然后进行UV固化处理。通过上述方式，本发明能够满足对于焊盘位置的高精度要求；此外采用丝网印刷法的制作成本相对较低，且该制作方法简单、容易进行推广应用。 【EN】The invention discloses a manufacturing method of a printed circuit board meeting the high-precision requirement of a pad position, which comprises the following steps of: (1) printing a bonding pad of a printed circuit board by adopting a screen printing method, and then carrying out UV curing treatment; (2) printing a circuit pattern on the printed circuit board obtained in the step (1) by adopting a screen printing method, and then carrying out UV curing treatment; (3) carrying out etching and ink stripping treatment on the printed circuit board obtained in the step (2); (4) and (4) printing solder resist ink on the surface of the printed circuit board obtained in the step (3) by adopting a screen printing method, and then carrying out UV curing treatment. By the mode, the high-precision requirement on the position of the bonding pad can be met; in addition, the manufacturing cost of the screen printing method is relatively low, and the manufacturing method is simple and easy to popularize and apply.