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申请号:201911341123.0 公开号:CN110970547A 主分类号:H01L33/64
申请人:【中文】陈元园【EN】Chen Yuanyuan 申请日:2019.12.23 公开日:2020.04.07
摘要:【中文】本发明公开了一种LED封装基底及LED封装结构,包括石墨基底、底座和芯片凹槽,所述石墨基底的顶端设置有绝缘氧化层,且绝缘氧化层的顶端两侧固定有保护层,所述保护层的顶端设置有导电层,且导电层的内部设置有第一接线口,所述导电层的顶端设置有外接电器层,所述第一接线口的一端设置有电极引线,所述第一接线口的通过电极引线与第二接线口相连接,所述第二接线口的一端设置有正极板,且正极板的右端固定有永久磁凹槽。本发明石墨基底的3个面呈锯齿状结构,且石墨基底的设置有8个锯齿形的支撑脚,锯齿形的结构的设计加快石墨基底的散热,降低工作时温度的升高对装置的性能的影响,同时也延长了装置的使用寿命。 【EN】The invention discloses an LED packaging substrate and an LED packaging structure, which comprise a graphite substrate, a base and a chip groove, wherein an insulating oxide layer is arranged at the top end of the graphite substrate, protective layers are fixed on two sides of the top end of the insulating oxide layer, a conductive layer is arranged at the top end of the protective layer, a first wiring port is arranged inside the conductive layer, an external electric appliance layer is arranged at the top end of the conductive layer, an electrode lead is arranged at one end of the first wiring port, the first wiring port is connected with a second wiring port through the electrode lead, a positive plate is arranged at one end of the second wiring port, and a permanent magnetic groove is fixed at the right end of the positive plate. 3 surfaces of the graphite substrate are of a sawtooth structure, the graphite substrate is provided with 8 sawtooth-shaped supporting legs, the heat dissipation of the graphite substrate is accelerated due to the design of the sawtooth structure, the influence of temperature rise on the performance of the device during working is reduced, and meanwhile, the service life of the device is prolonged.
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