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申请号:201880050809.1 公开号:CN111052055A 主分类号:G06F3/041
申请人:【中文】三星电子株式会社【EN】Samsung Electronics Co.,Ltd. 申请日:2018.08.10 公开日:2020.04.21
摘要:【中文】根据实施例,一种用于操作电子装置的方法可包括:在第一操作模式下根据第一驱动信号对被配置为检测触摸或悬停的触摸电路进行操作;检测与模式切换有关的第一事件;并且基于检测到第一事件,在第二操作模式下根据与第一驱动信号不同的第二驱动信号对触摸电路进行操作。其他实施例也是可能的。 【EN】According to an embodiment, a method for operating an electronic device may comprise: operating a touch circuit configured to detect a touch or hover according to a first drive signal in a first operation mode; detecting a first event related to a mode switch; and based on detecting the first event, operating the touch circuit in a second mode of operation according to a second drive signal different from the first drive signal. Other embodiments are also possible.
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申请号:201880068422.9 公开号:CN111247480A 主分类号:G02F1/1339
申请人:【中文】苹果公司【EN】Apple Inc. 申请日:2018.09.28 公开日:2020.06.05
摘要:【中文】电子设备可设置有显示器。光学组件窗口可在所述显示器的无效区域中形成。所述光学组件窗口可透射来自红外光源的红外光。所述红外光源可包括漫射器(52)以允许所述光源在泛光照明模式和结构光模式下操作。所述漫射器(52)可包括第一基板(58)和第二基板(60)之间的液晶材料(64)。密封剂(62)可围绕所述液晶层(64),并且一个或多个间隔壁(65‑1,65‑2)可位于所述密封剂(62)和所述液晶层(64)之间。另外的间隔壁可用在所述密封剂外部以防止金属在所述漫射器中的电极之间产生电短路。所述密封剂中的导电材料可用于将顶部电极耦接到底部基板上的金属垫。 【EN】The electronic device may be provided with a display. An optical component window may be formed in an inactive area of the display. The optical assembly window is transmissive to infrared light from an infrared light source. The infrared light source may include a diffuser (52) to allow the light source to operate in a flood lighting mode and a structured light mode. The diffuser (52) may include a liquid crystal material (64) between a first substrate (58) and a second substrate (60). A sealant (62) may surround the liquid crystal layer (64), and one or more barrier ribs (65-1,65-2) may be located between the sealant (62) and the liquid crystal layer (64). Additional spacer walls may be used outside the encapsulant to prevent metal from creating electrical shorts between electrodes in the diffuser. The conductive material in the encapsulant can be used to couple the top electrode to the metal pad on the bottom substrate.
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