摘要：【中文】一种IPM模块的芯片焊接方法，该芯片焊接方法具体包括以下步骤：将驱动芯片背面制备一层金属层；驱动芯片、IGBT芯片及FRD芯片分别采用锡膏涂敷；涂敷好锡膏之后的IGBT、FRD以及驱动芯片分别进行贴片；贴片后的IGBT、FRD以及驱动芯片分别采用真空回流焊工艺完成芯片焊料层焊接；通过在驱动芯片背面制备金属层，采用焊锡膏实现IGBT、FRD、驱动芯片的一次性焊接，省去传统焊接方法当中采用银胶进行驱动芯片焊接的步骤，进而提高生产效率，降低生产成本。 【EN】A chip welding method of an IPM module specifically comprises the following steps: preparing a metal layer on the back of the driving chip; the driving chip, the IGBT chip and the FRD chip are respectively coated by adopting solder paste; respectively pasting the IGBT, the FRD and the driving chip after the solder paste is coated; the IGBT, the FRD and the driving chip after being pasted are welded on a chip solder layer by adopting a vacuum reflow soldering process respectively; the metal layer is prepared on the back of the driving chip, the soldering paste is adopted to realize one-time welding of the IGBT, the FRD and the driving chip, the step of adopting the silver colloid to weld the driving chip in the traditional welding method is omitted, the production efficiency is further improved, and the production cost is reduced.