摘要：【中文】本发明涉及连续电镀领域，公开了一种BTB连接器端子的连续电镀工艺，该电镀工艺包括脱脂，铜抛光，酸洗，镀半光泽镍，镀高温镍，镀金，水性封孔。其中，镀半光泽镍溶液为：氨基磺酸镍550~650ml/l、氯化镍6~14g/l、硼酸35~45g/l、陶氏化学的MP200的添加剂10~20ml/l；镀高温镍溶液为：氨基磺酸镍400~500ml/l、氯化镍6~14g/l、硼酸35~45g/l、香港得力公司的TS添加剂，镀金溶液为美泰乐公司的FB7000。该工艺所镀BTB连接器端子焊板爬锡饱满且外观光亮；盐雾测试可通过48小时；可实现稳定的露镍区，预防焊板时锡膏爬到功能区。 【EN】The invention relates to the field of continuous electroplating, and discloses a continuous electroplating process for BTB connector terminals. Wherein, the semi-gloss nickel plating solution comprises the following components: 550-650 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid and 10-20 ml/l of additive of Dow chemical MP 200; the high-temperature nickel plating solution comprises the following steps: 400-500 ml/l of nickel sulfamate, 6-14 g/l of nickel chloride, 35-45 g/l of boric acid, TS additive of hong Kong Delile company, and FB7000 of Meitaile company as gold plating solution. The tin climbing of the terminal welding plate of the BTB plated connector is full and the appearance is bright; the salt spray test can pass 48 hours; can realize stable nickel exposure area and prevent solder paste from climbing to the functional area during board welding.