摘要：【中文】本文提供了封装半导体装置和其制造方法的实施例，所述封装半导体装置包括：半导体管芯，所述半导体管芯在有源侧上具有多个焊盘；虚设管芯，所述虚设管芯具有多个从第一主表面延伸到与所述第一主表面相对的第二主表面的开口，其中所述多个开口与所述多个焊盘对齐；以及硅基胶水，所述硅基胶水将所述虚设管芯附接到所述半导体管芯的所述有源侧，其中所述半导体管芯的多个可接合表面通过所述虚设管芯的所述多个开口暴露。 【EN】Embodiments of a packaged semiconductor device and method of manufacturing the same are provided herein, the packaged semiconductor device comprising: a semiconductor die having a plurality of pads on an active side; a dummy die having a plurality of openings extending from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads; and a silicon-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die.