摘要：【中文】本发明提供了一种墨水组合物、封装结构及半导体器件。该墨水组合物包括可光固化含硅单体组分、活性稀释剂组分和光引发剂组分，可光固化含硅单体组分为一种可光固化含硅单体或多种可光固化含硅单体的组合，各可光固化含硅单体具有结构式：且A₁和A₂中至少一个为丙烯酸酯基团，A₁和A₂中至少一个为环氧基团。将含有丙烯酸酯与环氧两种官能团的单体混合使用，可以形成自由基‑阳离子混杂固化体系，得到综合丙烯酸酯与环氧可光固化含硅单体优点的材料，实现具有较高光固化率、较低固化收缩率、基材附着力和硬度均适中的有机阻挡层。从而更好地满足了现有技术中对封装薄膜的要求。 【EN】The invention provides an ink composition, a packaging structure and a semiconductor device. The ink composition comprises a photocurable silicon-containing monomer component, an active diluent component and a photoinitiator component, wherein the photocurable silicon-containing monomer component is a photocurable silicon-containing monomer or a combination of a plurality of photocurable silicon-containing monomers, and each photocurable silicon-containing monomer has a structural formula:and A is₁And A₂At least one of which is an acrylate group, A₁And A₂At least one of which is an epoxy group. The monomer containing two functional groups of acrylate and epoxy is mixed for use to form a free radical-cation hybrid curing system, so that the material integrating the advantages of the acrylate and epoxy light-curable silicon-containing monomer is obtained, and the high light curing rate, the low curing shrinkage rate and the substrate adhesion are realizedAnd an organic barrier layer of moderate hardness. Thereby better satisfying the requirements of the prior art on the packaging film.

摘要：【中文】本发明提供了一种光固化封装组合物、封装结构及半导体器件。包括可光固化含硅单体、可光固化含环氧烷基稀释剂和光引发剂，可光固化含硅单体具有如下结构式：其中，n是0到50的任意一个整数，X¹、X²、X³、X⁴、X⁵、X⁶中的至少一个是取代或未经取代的C₆到C₅₀的芳基、取代或未取代的C₇到C₅₀的芳烷基中的任意一种，由于采用具有上述结构式I的可固化含硅单体作为聚合的单体，由于其中包含的苯环和环氧基团，在将其与可固化含环氧烷基稀释剂进行配合时，所形成的聚合物薄膜具有更高的光透过率、更高的固化速度、更低的等离子体刻蚀速率，从而更好地满足了现有技术中封装薄膜的要求。 【EN】The invention provides a photocuring packaging composition, a packaging structure and a semiconductor device. The light-curable silicon-containing monomer comprises a light-curable silicon-containing monomer, a light-curable epoxy alkyl-containing diluent and a photoinitiator, wherein the light-curable silicon-containing monomer has the following structural formula:wherein n is an integer of 0 to 50, and X is¹、X²、X³、X⁴、X⁵、X⁶Is substituted or unsubstituted C₆To C₅₀Aryl, substituted or unsubstituted C₇To C₅₀Because the curable silicon-containing monomer with the structural formula I is used as a polymerized monomer, and because the benzene ring and the epoxy group are contained in the polymerizable silicon-containing monomer, when the polymerizable silicon-containing monomer is matched with the curable epoxy alkyl-containing diluent, the formed polymer film has higher light transmittance, higher curing speed and lower plasma etching rate, thereby better meeting the requirements of the packaging film in the prior art.