当前查询到14条专利与查询词 "王鹏【EN】Ma Xuan"相关,搜索用时0.2187267秒!排序方式:
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申请号:201911129641.6 公开号:CN111123716A 主分类号:G05B15/02
摘要:【中文】本公开是关于一种远程控制方法、远程控制装置及计算机可读存储介质。远程控制方法中,在接收到用于控制指定位置处的第二设备执行指定功能的功能指令时,通过所述定位设备定位到所述指定位置处的第二设备。向所述第二设备发送执行所述指定功能的功能指令,控制所述第二设备执行所述指定功能。通过本公开实现设备之间基于位置的灵活准确配置。 【EN】The present disclosure relates to a remote control method, a remote control apparatus, and a computer-readable storage medium. In the remote control method, when a function instruction for controlling a second device at a specified position to execute a specified function is received, the second device at the specified position is located by the locating device. And sending a function instruction for executing the specified function to the second equipment, and controlling the second equipment to execute the specified function. The flexible and accurate configuration based on the position between the devices is realized through the method and the device.
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申请号:201911129303.2 公开号:CN111031522A 主分类号:H04W4/80
摘要:【中文】本公开是关于一种设备绑定方法、设备绑定装置及计算机可读存储介质。设备绑定方法,应用于第一设备,包括:监听第二设备发送的无线通信信号,第二设备为未绑定指定账号的设备。响应于监听到第二设备发送的无线通信信号,且第二设备与第一设备之间的距离小于设定距离阈值,向第二设备发送绑定请求并将第二设备与指定账号进行绑定。根据本公开的实施例提供的设备绑定方法,第一设备通过监听周围无线通信信号,将其他设备自主绑定在同一指定账号下。无需通过用户操作,便可将多个设备进行绑定,方便快捷,有助于提升用户对设备控制的使用体验。 【EN】The disclosure relates to a device binding method, a device binding apparatus and a computer readable storage medium. The device binding method is applied to a first device and comprises the following steps: and monitoring a wireless communication signal sent by second equipment, wherein the second equipment is equipment without a bound specified account. And in response to the fact that the wireless communication signal sent by the second device is monitored, and the distance between the second device and the first device is smaller than a set distance threshold, sending a binding request to the second device and binding the second device with the specified account. According to the device binding method provided by the embodiment of the disclosure, the first device autonomously binds other devices under the same specified account by monitoring surrounding wireless communication signals. Need not through user operation, alright bind a plurality of equipment, convenient and fast helps promoting the user to the use experience of equipment control.
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申请号:201911144282.1 公开号:CN110932347A 主分类号:H02J7/00
摘要:【中文】本公开是关于一种信息处理方法及装置、移动设备、存储介质,所述方法应用于包含移动底盘的移动设备中,包括:获取与所述移动设备关联的智能设备的充电请求;确定所述移动设备的移动空间内是否有生命体;若没有生命体,启动无线充电功能,向有所述充电请求的智能设备进行无线充电。通过该方法,提升了移动设备的智能化程度。 【EN】The present disclosure relates to an information processing method and apparatus, a mobile device, and a storage medium, wherein the method is applied to a mobile device including a mobile chassis, and includes: acquiring a charging request of an intelligent device associated with the mobile device; determining whether a living body is in a moving space of the mobile device; and if no life body exists, starting a wireless charging function, and wirelessly charging the intelligent equipment with the charging request. By the method, the intelligent degree of the mobile equipment is improved.
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申请号:201911421077.5 公开号:CN111009497A 主分类号:H01L23/373
申请人:【中文】长春理工大学【EN】CHANGCHUN UNIVERSITY OF SCIENCE AND TECHNOLOGY 申请日:2019.12.31 公开日:2020.04.14
摘要:【中文】本发明涉及新型衬底材料技术领域,提供了一种高导热率半导体衬底,所述高导热率半导体衬底中半导体基底背面为连续沟槽结构,所述连续沟槽结构的内表面被类金刚石薄膜覆盖;所述连续沟槽结构的深度为8~12μm。本发明将高导热率半导体衬底的沟槽结构设计成连续的,然后在连续沟槽的内表面覆盖类金刚石薄膜,利用类金刚石薄膜的高热导特性以及连续沟槽结构,使得本发明提供的半导体衬底在具有纵向高效散热的同时,兼具横向散热的优势,有效提高了半导体衬底的导热效率。本发明提供的半导体衬底在纵向及横向均能高效散热,大大提高了散热效果。 【EN】The invention relates to the technical field of novel substrate materials, and provides a high-thermal-conductivity semiconductor substrate, wherein the back surface of a semiconductor base in the high-thermal-conductivity semiconductor substrate is of a continuous groove structure, and the inner surface of the continuous groove structure is covered by a diamond-like carbon film; the depth of the continuous groove structure is 8-12 mu m. According to the invention, the groove structure of the semiconductor substrate with high thermal conductivity is designed to be continuous, then the inner surface of the continuous groove is covered with the diamond-like film, and the high thermal conductivity of the diamond-like film and the continuous groove structure are utilized, so that the semiconductor substrate provided by the invention has the advantages of longitudinal high-efficiency heat dissipation, transverse heat dissipation and effective improvement of the heat conduction efficiency of the semiconductor substrate. The semiconductor substrate provided by the invention can efficiently dissipate heat in the longitudinal direction and the transverse direction, and the heat dissipation effect is greatly improved.
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申请号:201911397642.9 公开号:CN111129184A 主分类号:H01L31/0236
申请人:【中文】长春理工大学【EN】CHANGCHUN UNIVERSITY OF SCIENCE AND TECHNOLOGY 申请日:2019.12.30 公开日:2020.05.08
摘要:【中文】本发明涉及半导体技术领域,提供了一种高效散热半导体衬底及其制备方法。本发明在半导体基底背面沉积金刚石薄膜,然后在正面依次进行减薄和抛光,得到高效散热半导体衬底。本发明提供的衬底正面为极薄的半导体衬底层,背面为高效散热的金刚石薄膜,既符合材料外延生长的要求,也具有优良的导热能力,利用其制备半导体光电子器件,能够提升器件的性能,免除常规光电子器件制备工艺中的减薄、抛光的工艺步骤,不会对正面的器件结构及正面电极造成损伤。 【EN】The invention relates to the technical field of semiconductors, and provides a high-efficiency heat-dissipation semiconductor substrate and a preparation method thereof. According to the invention, the diamond film is deposited on the back surface of the semiconductor substrate, and then thinning and polishing are sequentially carried out on the front surface, so that the high-efficiency heat-dissipation semiconductor substrate is obtained. The front surface of the substrate provided by the invention is an extremely thin semiconductor substrate layer, and the back surface of the substrate is a diamond film with high-efficiency heat dissipation, so that the substrate meets the requirement of material epitaxial growth and has excellent heat conduction capability.
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申请号:201811315097.X 公开号:CN111136907A 主分类号:B29C63/34
摘要:【中文】本发明公开了一种内衬管定型设备,属于内衬管加工技术领域。所述;设备包括:加热组件、封口螺母、双螺纹接头、快换接头、连接管以及空压机,封口螺母安装在油管的第一管口处,油管内部包含内衬管;双螺纹接头和快换接头用于通过螺纹连接油管的第二管口和连接管的第三管口;连接管的第四管与空压机的排气孔密闭相连;在对内衬管进行定型处理时,在预设时长内,加热组件对油管周围空间进行加热,空压机通过排气孔对内衬管的内部进行加压,使得内衬管和油管之间包括有缺陷的位置都紧密贴合,并使得内衬管定型,从而缓解油管使用过程中对内衬管的磨损,有效的提高内衬管的使用寿命。 【EN】The invention discloses lining pipe shaping equipment, and belongs to the technical field of lining pipe processing. The method comprises the following steps of; the apparatus comprises: the quick-change connector comprises a heating assembly, a sealing nut, a double-thread connector, a quick-change connector, a connecting pipe and an air compressor, wherein the sealing nut is installed at a first pipe orifice of an oil pipe, and an inner lining pipe is arranged inside the oil pipe; the double-thread joint and the quick-change joint are used for connecting a second pipe orifice of the oil pipe and a third pipe orifice of the connecting pipe through threads; the fourth pipe of the connecting pipe is hermetically connected with an exhaust hole of the air compressor; when setting the lining pipe, in predetermineeing long the time, heating element heats oil pipe surrounding space, and the air compressor machine pressurizes the inside of lining pipe through the exhaust vent for closely laminating including the defective position between lining pipe and the oil pipe, and make lining pipe design, thereby alleviate the wearing and tearing of oil pipe in the use, the life of the lining pipe in the effectual improvement.
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申请号:201911411778.0 公开号:CN111082307A 主分类号:H01S5/02
申请人:【中文】长春理工大学【EN】CHANGCHUN UNIVERSITY OF SCIENCE AND TECHNOLOGY 申请日:2019.12.31 公开日:2020.04.28
摘要:【中文】本发明提供了一种低应力高导热半导体衬底及其制备方法,属于半导体技术领域。本发明提供的半导体衬底中,背面设置有周期分布排列的孔洞,且填充有弹性纳米导热材料,所制备的焊料层将弹性纳米导热材料密封在衬底基体背面所制备的孔洞中,器件通电工作时,会产生大量的热,孔洞在受热膨胀后会变小,弹性纳米导热材料受到挤压时仍能够与焊料保持良好接触,并给芯片膨胀留有足够的空间,使芯片膨胀时仍能够与焊料保持很好的接触,减小了芯片与所填充的弹性纳米导热材料的热应力,也减少了芯片本身受热膨胀的应力,且能够保持高散热能力。 【EN】The invention provides a low-stress high-thermal conductivity semiconductor substrate and a preparation method thereof, belonging to the technical field of semiconductors. In the semiconductor substrate provided by the invention, the back surface is provided with the holes which are periodically distributed and arranged and filled with the elastic nano heat conduction material, the prepared solder layer seals the elastic nano heat conduction material in the holes prepared on the back surface of the substrate matrix, when the device is electrified to work, a large amount of heat can be generated, the holes can be reduced after being heated and expanded, the elastic nano heat conduction material can still be well contacted with the solder when being extruded, and enough space is reserved for the expansion of the chip, so that the chip can still be well contacted with the solder when being expanded, the thermal stress of the chip and the filled elastic nano heat conduction material is reduced, the stress of the chip which is heated and expanded is also reduced, and high heat dissipation capability can be maintained.
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申请号:201910458987.4 公开号:CN111150477A 主分类号:A61B17/80
申请人:【中文】天津市天津医院【EN】TIANJIN Hospital 申请日:2019.05.29 公开日:2020.05.15
摘要:【中文】一种腔镜专用多角度肋骨板施夹钳,包括钳体、后把手、前把手、后簧片、前簧片、固定部、牵引绳、第一钳臂、第二钳臂、销钉、弹簧、限位孔,钳体后侧设有后把手,钳体前侧设有前把手,前把手与钳体通过转轴转动连接,后把手上设有后簧片,后簧片上设有设有矩形槽,前把手上设有前簧片,前簧片前端穿过后簧片上的矩形槽与后簧片构成X形结构,前把手上设有固定部,固定部与牵引绳一端固定连接,钳体前端设有第一钳臂,第一钳臂后端通过销钉与钳体转动连接,第一钳臂前端设有第二钳臂,第二钳臂又包括上钳臂、下钳臂、夹持部、滑槽、滑块。本发明的优点在于:贴合人体胸腔表面的曲线弧度,可以进行多角度的灵活调节,便于操作,适用于微创手术。 【EN】The utility model provides a special multi-angle rib plate of chamber mirror pincers of executing, including the pincers body, the back handle, preceding handle, the back reed, preceding reed, the fixed part, the haulage rope, first tong arm, the second tong arm, the pin, a spring, spacing hole, pincers body rear side is equipped with the back handle, pincers body front side is equipped with preceding handle, preceding handle rotates through the pivot with the pincers body to be connected, be equipped with the back reed on the back handle, be equipped with the rectangular channel on the back reed, be equipped with preceding reed on the preceding handle, the rectangular channel that the front end passed on the back reed constitutes X-shaped structure with the back reed, be equipped with the fixed part on the preceding handle, fixed part and haulage rope one end fixed connection, pincers body front end is equipped with first tong arm, first tong arm rear end passes through the pin and is connected with pincers body rotation, first tong arm front end is equipped with second tong arm, second tong arm includes last tong arm again, lower tong arm, the clamping part, the spout. The invention has the advantages that: the curve radian of the surface of the thoracic cavity of the human body is attached, so that the multi-angle flexible adjustment can be performed, the operation is convenient, and the minimally invasive surgery instrument is suitable for minimally invasive surgery.
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申请号:201911419084.1 公开号:CN110966207A 主分类号:F04D1/06
申请人:【中文】郭学文【EN】Guo Xuewen 申请日:2019.12.31 公开日:2020.04.07
摘要:【中文】本发明涉及一种完全平衡节能多级离心泵,包括:外壳和转子,转子包括主轴、滚柱轴承、轴承挡套、左轴套、叶轮挡套、正流道首级叶轮、左叶轮衬套、正流道叶轮、完全平衡系统、反流道叶轮、右叶轮衬套、反流道首级叶轮、迷宫减压套、右轴套、滚珠轴承,滚柱轴承、轴承挡套、左轴套、叶轮挡套、正流道首级叶轮、左叶轮衬套、正流道叶轮、完全平衡系统、反流道叶轮、右叶轮衬套、反流道首级叶轮、迷宫减压套、右轴套、滚珠轴承依次安装在主轴上,叶轮挡套安装在轴套和正流道首级叶轮之间,左叶轮衬套安装在两个相邻的正流道叶轮之间,右叶轮衬套安装在两个相邻的反流道叶轮之间,完全平衡系统安装在正流道末级叶轮和反流道末级叶轮之间,迷宫减压套与反流道首级叶轮相邻,反流道首级叶轮与反流道导叶相邻。 【EN】The invention relates to a complete balance energy-saving multistage centrifugal pump, comprising: a housing and a rotor, the rotor comprising a main shaft, a roller bearing, a bearing spacer, a left shaft sleeve, an impeller spacer, a forward flow path first-stage impeller, a left impeller bushing, a forward flow path impeller, a complete balance system, a reverse flow path impeller, a right impeller bushing, a reverse flow path first-stage impeller, a labyrinth pressure reducing sleeve, a right shaft sleeve, a ball bearing, the roller bearing, the bearing spacer, the left shaft sleeve, the impeller spacer, the forward flow path first-stage impeller, the left impeller bushing, the forward flow path impeller, the complete balance system, the reverse flow path impeller, the right impeller bushing, the reverse flow path first-stage impeller, the labyrinth pressure reducing sleeve, the right shaft sleeve, and the ball bearing are sequentially mounted on the main shaft, the impeller spacer is mounted between the shaft sleeve and the forward flow path first-stage impeller, the left impeller bushing is mounted between two adjacent forward flow path impellers, the right impeller bushing is mounted between two adjacent reverse flow path impellers, the complete balance system is mounted between the forward flow path last-stage impeller and the reverse, the labyrinth pressure reducing sleeve is adjacent to the first-stage impeller of the reverse flow passage, and the first-stage impeller of the reverse flow passage is adjacent to the guide vane of the reverse flow passage.
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申请号:201911391669.7 公开号:CN110979611A 主分类号:B63G8/22
摘要:【中文】本发明涉及水下大深度多功能固体压载抛载装置,包括机架(1),液压缸(3),抓勾(5),通轴(11)和框架(2),所述抓勾(5)与机架通过所述通轴(11)连接,液压缸的活塞杆(306)与抓勾(5)枢轴连接,所述框架(2)通过固定轴(13)与机架连接,所述活塞杆(306)缩回时,活塞杆(306)带动抓勾(5)绕通轴(11)逆时针转动钩住框架上的锁紧轴(21),所述活塞杆(306)伸出时,活塞杆(306)带动抓勾(5)绕通轴(11)顺时针转动,抓勾(5)与锁紧轴(21)松开。水下大深度多功能固体压载抛载装置能够解决现有固体压载抛载装置不能实现超深抛出,及不能适用不同工作深度且调试不便的问题。 【EN】The invention relates to an underwater large-depth multifunctional solid ballast load rejection device which comprises a rack (1), a hydraulic cylinder (3), a grabbing hook (5), a through shaft (11) and a frame (2), wherein the grabbing hook (5) is connected with the rack through the through shaft (11), a piston rod (306) of the hydraulic cylinder is connected with the grabbing hook (5) through a pivot, the frame (2) is connected with the rack through a fixed shaft (13), when the piston rod (306) retracts, the piston rod (306) drives the grabbing hook (5) to rotate around the through shaft (11) anticlockwise to hook a locking shaft (21) on the frame, when the piston rod (306) extends out, the piston rod (306) drives the grabbing hook (5) to rotate around the through shaft (11) clockwise, and the grabbing hook (5) and the locking shaft (21) are loosened. The underwater large-depth multifunctional solid ballast load rejection device can solve the problems that the conventional solid ballast load rejection device cannot realize ultra-deep throwing, cannot be suitable for different working depths and is inconvenient to debug.
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