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申请号:201911046013.1 公开号:CN111128796A 主分类号:H01L21/67
摘要:【中文】本公开实施例提供多种用于搬运半导体部件承载器的设备及方法。在一范例中,公开一种用于搬运半导体部件承载器的设备。此设备包括一机械手臂及耦接到机械手臂的一成像系统。机械手臂配置以固持一半导体部件承载器。成像系统配置以在将放置半导体部件承载器的表面上自动定位一目标位置。 【EN】The disclosed embodiments provide various apparatuses and methods for handling semiconductor component carriers. In one example, an apparatus for handling a semiconductor component carrier is disclosed. The apparatus includes a robot and an imaging system coupled to the robot. The robot arm is configured to hold a semiconductor component carrier. The imaging system is configured to automatically locate a target location on a surface on which the semiconductor component carrier is to be placed.
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