摘要：【中文】本发明涉及一种去除FPC覆盖膜的方法，包括：去除FPC外层绝缘膜，得到第一中间板；膨松处理，对所述第一中间板进行膨松处理，得到第二中间板；等离子处理，对所述第二中间板进行等离子处理，得到第三中间板；超声波振荡清洗处理，对所述第三中间板进行清洗，得成品。本发明通过去除FPC外层绝缘膜、膨松处理、等离子处理、振荡清洗，并在其中进行两次摩擦处理，能够有效去除FPC外层绝缘膜以及软胶，使得内层的铜导线可以清晰地露出，且不会出现采用水平切片方法研磨中一部分线路研磨到位，另一部分线路被研磨消失的情况，便于在FPC线路类品质缺陷时，直接观察线路的情况以确定失效原因，操作简单，耗时短、成本低，便于FPC线路类缺陷的分析。 【EN】The invention relates to a method for removing an FPC (flexible printed circuit) cover film, which comprises the following steps: removing the outer insulating film of the FPC to obtain a first middle plate; bulking, namely bulking the first intermediate plate to obtain a second intermediate plate; performing plasma treatment, namely performing plasma treatment on the second intermediate plate to obtain a third intermediate plate; and (4) ultrasonic oscillation cleaning treatment, namely cleaning the third intermediate plate to obtain a finished product. According to the invention, the FPC outer insulating film and the soft rubber can be effectively removed by removing the FPC outer insulating film, bulking treatment, plasma treatment and oscillation cleaning, and performing two times of rubbing treatment in the FPC outer insulating film, so that the inner layer copper conductor can be clearly exposed, and the condition that one part of circuits are ground in place and the other part of circuits are ground to disappear in the horizontal slicing method grinding process is avoided, so that when the FPC circuits have quality defects, the condition of the circuits can be directly observed to determine the failure reason, the operation is simple, the time consumption is short, the cost is low, and the analysis of the FPC circuits defects is facilitated.