摘要：【中文】一种图像传感器封装，包括盖板玻璃、图像传感器以及集成电路。盖板玻璃具有盖板玻璃底表面，图像传感器接合到该盖板玻璃底表面。集成电路位于盖板玻璃底表面下方，与图像传感器相邻，并且电连接到图像传感器。一种用于封装图像传感器的方法，包括将图像传感器附着到盖板玻璃的盖板玻璃底表面，所述图像传感器的光感测区域面向盖板玻璃底表面。该方法还包括将集成电路附着到盖板玻璃底表面，所述集成电路的顶部IC表面面向盖板玻璃底表面。 【EN】An image sensor package includes a cover glass, an image sensor, and an integrated circuit. The cover glass has a cover glass bottom surface to which the image sensor is bonded. The integrated circuit is located below the bottom surface of the cover glass, adjacent to the image sensor, and electrically connected to the image sensor. A method for packaging an image sensor includes attaching an image sensor to a bottom surface of a cover glass, a light sensing area of the image sensor facing the bottom surface of the cover glass. The method also includes attaching an integrated circuit to the bottom surface of the cover glass with a top IC surface of the integrated circuit facing the bottom surface of the cover glass.