摘要：【中文】本发明公开了一种新型散热的铝基PCB板及压合工艺，所述铝基板PCB板包括自上而下依次设计的多层PCB板、导电胶及铝基板，多层PCB板与铝基板通过导电胶压合粘结；所述多层PCB板由单层PCB通过半固化片压合而成。本发明解决了现有采用金属基板制作多层PCB板的压合工艺中，压合后整体板面产生翘曲，铝基板易因腐蚀造成板面减薄或不平整，导致后期使用加工困难的技术问题。本发明的铝基PCB板，加工工艺简单，制造成本低，散热性能好且翘曲度低。 【EN】The invention discloses a novel heat-radiating aluminum-based PCB and a laminating process, wherein the aluminum-based PCB comprises a plurality of layers of PCBs, conductive adhesive and an aluminum substrate which are sequentially designed from top to bottom, and the plurality of layers of PCBs and the aluminum substrate are bonded through the conductive adhesive in a laminating manner; the multilayer PCB is formed by pressing a single-layer PCB through prepregs. The invention solves the technical problems that in the existing pressing process for manufacturing the multilayer PCB by adopting the metal substrate, the whole board surface is warped after pressing, and the board surface is easy to be thinned or unsmooth due to corrosion of the aluminum substrate, so that the later-stage use and processing are difficult. The aluminum-based PCB disclosed by the invention is simple in processing technology, low in manufacturing cost, good in heat dissipation performance and low in warping degree.