摘要：【中文】本发明提供一种显影洗边设备和显影洗边方法，显影洗边设备包括显影液喷洒部和冲洗部；冲洗部内的冲洗喷头安装在晶圆面上方的移动架体上，并可随移动架体一起沿晶圆径向往复移动；显影洗边设备还包括能够喷洒洗边用溶液的洗边部，所述洗边部的洗边喷头设置在所述晶圆面的上方，并能够在设定洗边起始位置与晶圆边缘之间往复移动。使用本发明显影洗边设备和显影洗边方法中可以将显影与洗边工序合二为一，简化了工序步骤，在洗边的过程中其通过将洗边用溶液喷涂在旋转的晶圆边缘从而在显影过程中直接进行光刻胶及有害残留物的清洗，不仅去边能力强，去胶效果佳，而且能够在曝光冲洗后甩干晶圆的同时进行洗边，节省工艺时间，提高了生产效率。 【EN】The invention provides a developing edge-washing device and a developing edge-washing method, wherein the developing edge-washing device comprises a developing solution spraying part and a washing part; the washing nozzle in the washing part is arranged on the movable frame body above the wafer surface and can reciprocate along the radial direction of the wafer along with the movable frame body; the developing and edge-washing equipment also comprises an edge-washing part capable of spraying solution for edge washing, wherein an edge-washing nozzle of the edge-washing part is arranged above the wafer surface and can reciprocate between a set edge-washing initial position and the edge of the wafer. The developing and edge-washing process can be combined into a whole by using the developing and edge-washing equipment and the developing and edge-washing method, the process steps are simplified, the edge-washing solution is sprayed on the edge of a rotating wafer in the edge-washing process, so that the photoresist and harmful residues are directly cleaned in the developing process, the edge-removing capacity is strong, the photoresist removing effect is good, the edge washing can be carried out while the wafer is dried after exposure and washing, the process time is saved, and the production efficiency is improved.

摘要：【中文】本发明实施例提供了一种晶圆承载装置，包括：承载本体，在对晶圆进行光刻工艺处理过程中，所述晶圆设置在所述承载本体上；限位部件，在对所述晶圆进行光刻工艺处理过程中，通过所述限位部件限制所述晶圆在所述承载本体上的移动；所述限位部件包括：第一部分及第二部分；其中，所述第一部分设置在所述承载本体的上表面上，且所述第一部分中靠近晶圆的侧面与所述承载本体的上表面垂直；所述第二部分设置在所述第一部位上，且所述第二部分中靠近晶圆的侧面与所述第一部分中靠近晶圆的侧面之间的角度大于90度且小于180度。如此，能够很好地满足在对晶圆进行光刻工艺处理过程中的实际承载要求。 【EN】The embodiment of the invention provides a wafer bearing device, which comprises: the wafer processing device comprises a bearing body, a first processing unit and a second processing unit, wherein the bearing body is arranged on a wafer in the photoetching process; the limiting component is used for limiting the movement of the wafer on the bearing body in the photoetching process of the wafer; the limiting part comprises: a first portion and a second portion; the first part is arranged on the upper surface of the bearing body, and the side surface of the first part close to the wafer is vertical to the upper surface of the bearing body; the second portion is arranged on the first portion, and an angle between a side face, close to the wafer, of the second portion and a side face, close to the wafer, of the first portion is larger than 90 degrees and smaller than 180 degrees. Therefore, the actual bearing requirement in the process of carrying out photoetching process on the wafer can be well met.