摘要：【中文】本发明公开了一种具滚动支撑结构之线性马达总成，包括一纵向形成有一长槽的基座，长槽的底面装设有一定子，定子至少一侧设置有一动作路径，且定子上设置有一系列第一磁极；一滑设于长槽中的动子，动子邻近第一磁极的一侧设有一第二磁极，通过第一磁极与第二磁极的交互作用，令动子沿长槽相对于定子作往复式直线移动；至少一滚动支撑结构，至少一滚动支撑结构装设于第二磁极的至少一侧，并提供动子反重力方向的支撑；至少一滚动支撑结构于至少一动作路径上往复移动。 【EN】The invention discloses a linear motor assembly with a rolling support structure, which comprises a base, a stator and a plurality of first magnetic poles, wherein a long groove is longitudinally formed on the base; the rotor is arranged in the long groove in a sliding mode, one side, close to the first magnetic pole, of the rotor is provided with a second magnetic pole, and the rotor is enabled to move linearly in a reciprocating mode relative to the stator along the long groove through the interaction of the first magnetic pole and the second magnetic pole; the at least one rolling support structure is arranged on at least one side of the second magnetic pole and provides support for the rotor in the direction of counter-gravity; the at least one rolling support structure reciprocates on the at least one motion path.

摘要：【中文】在一些实施例中提供一种运输系统，包括：自动车，配置成横越第一预定路径；以及感应器系统，位在自动车上，感应器系统配置成沿着在自动车前方的一或两个楼板沿着第一预定路径上检测垂直障碍物，其中自动车配置成响应于检测到垂直障碍物而横越第二预定路径。 【EN】In some embodiments there is provided a transport system comprising: an automotive vehicle configured to traverse a first predetermined path; and a sensor system located on the automotive vehicle, the sensor system configured to detect a vertical obstacle along a first predetermined path along one or both floors in front of the automotive vehicle, wherein the automotive vehicle is configured to traverse a second predetermined path in response to detecting the vertical obstacle.

摘要：【中文】本公开实施例提供多种用于搬运半导体部件承载器的设备及方法。在一范例中，公开一种用于搬运半导体部件承载器的设备。此设备包括一机械手臂及耦接到机械手臂的一成像系统。机械手臂配置以固持一半导体部件承载器。成像系统配置以在将放置半导体部件承载器的表面上自动定位一目标位置。 【EN】The disclosed embodiments provide various apparatuses and methods for handling semiconductor component carriers. In one example, an apparatus for handling a semiconductor component carrier is disclosed. The apparatus includes a robot and an imaging system coupled to the robot. The robot arm is configured to hold a semiconductor component carrier. The imaging system is configured to automatically locate a target location on a surface on which the semiconductor component carrier is to be placed.