摘要：【中文】本发明属于无铆钉铆接技术领域，尤其涉及一种无铆钉铆接马氏体钢板的装置及其方法。所述装置包括：上模具、下模具、冲头、托头、上激光加热器、下激光加热器、热敏电阻和冷却水道。上模具、下模具的中心均设置有通孔，上模具，下模具为上、下对称设置的结构，冲头位于上模具的通孔中，托头位于下模具中的通孔中，且冲头和托头在各自的通孔中均能够自由运动。上激光加热器设置在冲头的底面中，下激光加热器设置在托头的顶面中，上模具、下模具中均设置有热敏电阻和冷却水道，且冲头中靠近上激光加热器的位置以及托头中靠近下激光加热器的位置也设置有冷却水道。上述装置形成的铆钉和底层材料实现互锁，保证高的连接强度。 【EN】The invention belongs to the technical field of rivet-free riveting, and particularly relates to a device and a method for riveting a martensitic steel plate without a rivet. The device comprises: the device comprises an upper die, a lower die, a punch, a supporting head, an upper laser heater, a lower laser heater, a thermistor and a cooling water channel. The center of the upper die and the center of the lower die are both provided with through holes, the upper die and the lower die are of structures which are symmetrically arranged up and down, the punch is positioned in the through holes of the upper die, the support head is positioned in the through holes of the lower die, and the punch and the support head can freely move in the respective through holes. The upper laser heater is arranged in the bottom surface of the punch, the lower laser heater is arranged in the top surface of the support head, the upper die and the lower die are both provided with thermistors and cooling water channels, and the position in the punch, which is close to the upper laser heater, and the position in the support head, which is close to the lower laser heater, are also provided with cooling water channels. The rivet and the bottom layer material formed by the device are interlocked, so that high connection strength is ensured.

摘要：【中文】本发明提供一种用于用电信息采集系统的RS485通信适配器及控制方法，属于通信领域，包括电源模块、单片机和至少3个MAX485通信芯片，MAX485通信芯片分为主从等级，单片机采用自由总线令牌机制控制MAX485通信芯片实现有序收发数据状态以及收发状态切换；在MAX485通信芯片进入发送状态时，由单片机进行隔离计时，避免出现发送节点故障，一直霸占信道的情况出现；并且在主MAX485接收TTL电平为“1”时，通过上拉电阻R7、下拉R8的共同作用，使总线保持高电平输出状态，达到了发送“1”的效果。 【EN】The invention provides an RS485 communication adapter for a power consumption information acquisition system and a control method, belonging to the field of communication, and comprising a power module, a singlechip and at least 3 MAX485 communication chips, wherein the MAX485 communication chips are divided into master and slave grades, and the singlechip controls the MAX485 communication chips to realize the ordered data receiving and transmitting state and the switching of the receiving and transmitting state by adopting a free bus token mechanism; when the MAX485 communication chip enters a sending state, the singlechip carries out isolation timing, so that the condition that a sending node is in fault and always occupies a channel is avoided; when the receiving TTL level of the main MAX485 is 1, the bus is kept in a high-level output state through the combined action of the pull-up resistor R7 and the pull-down resistor R8, and the effect of sending 1 is achieved.