摘要：【中文】本发明涉及用于测量特别是由可微加工材料制成的游丝(1)的力矩的方法，其中，夹具(500)将内桩(2)放置在方尖塔形的模拟心轴(10)的顶点(19)上的插入引导部(12)上，引导部用于内桩(2)的第一次对中，该游丝被允许在其自重作用下沿着位于截锥形柄部(11)上方的引导部(12)滑动，柄部完成内桩在工具轴线(DO)上的自动对中，并用于将游丝(1)无应力地保持在柄部(11)上，模拟心轴包括与内桩(2)的内部轮廓配合的驱动装置(100)，以相对驱动内桩(2)旋转而不滑动，保持工具(20)保持游丝(1)的外圈(6)，以在不对游丝(1)施加压力的情况下通过使主工具和/或保持工具(20)绕轴线(DO)旋转来测量游丝(1)的力矩。 【EN】The invention relates to a method for measuring the torque of a balance spring (1), in particular made of micro-machinable material, wherein a clamp (500) places a collet (2) on an insertion guide (12) on the apex (19) of a frustum-shaped dummy mandrel (10) for the first centering of the collet (2), which is allowed to slide under its own weight along the guide (12) above a truncated-cone-shaped shank (11) which performs the self-centering of the collet on the tool axis (DO) and serves to hold the balance spring (1) unstressed on the shank (11), the dummy mandrel comprising a drive device (100) which cooperates with the internal profile of the collet (2) to drive the collet (2) in rotation with respect to it without sliding, a holding tool (20) holding the outer ring (6) of the balance spring (1) to rotate the main tool and/or the holding tool (20) about the axis (DO) without applying pressure to the balance spring (1) The moment of the balance spring (1) is measured.

摘要：【中文】一种光刻设备包括：衬底台、曝光后处理模块、衬底处理机器人及干燥站。所述衬底台被配置成支撑衬底用于曝光过程。所述曝光后处理模块是用于在曝光后处理所述衬底。所述衬底处理机器人被配置成将所述衬底从所述衬底台沿着衬底卸载路径转移至所述曝光后处理模块中。所述干燥站被配置成从所述衬底的表面主动地移除液体。所述干燥站定位于所述衬底卸载路径中。所述干燥站定位于所述曝光后处理模组中。所述曝光后处理模块可以是晶片处理器。 【EN】A lithographic apparatus comprising: a substrate table, a post-exposure processing module, a substrate processing robot, and a drying station. The substrate table is configured to support a substrate for an exposure process. The post-exposure processing module is used for processing the substrate after exposure. The substrate handling robot is configured to transfer the substrate from the substrate table into the post-exposure handling module along a substrate unloading path. The drying station is configured to actively remove liquid from the surface of the substrate. The drying station is positioned in the substrate unloading path. The drying station is positioned in the post-exposure treatment module. The post-exposure processing module may be a wafer handler.