摘要：【中文】本发明涉及一种发光二极管模块，包括：光源单元，包含发光部、第一电极垫和第二电极垫，向前面射出光；引脚框架单元，设置于光源单元的背面，包含分别连接于第一电极垫和第二电极垫的第一引脚端子和第二引脚端子；基板，设置于光源单元及引脚框架单元的侧面，并与第一引脚端子和第二引脚端子电连接，其中，第一引脚端子和第二引脚端子中的至少一个包含设置于互不相同的层且彼此电连接的上部导电层、中间导电层及下部导电层，引脚框架单元包括第一绝缘基板及第二绝缘基板，上部导电层设置于光源单元与第一绝缘基板之间，中间导电层设置于第一绝缘基板与第二绝缘基板之间，下部导电层设置于第二绝缘基板上，并设置于设置有中间导电层的面的相反面。 【EN】The invention relates to a light emitting diode module, comprising: a light source unit including a light emitting portion, a first electrode pad, and a second electrode pad, and emitting light to the front surface; the lead frame unit is arranged on the back of the light source unit and comprises a first lead terminal and a second lead terminal which are respectively connected with the first electrode pad and the second electrode pad; and a substrate disposed on side surfaces of the light source unit and the lead frame unit and electrically connected to the first and second lead terminals, wherein at least one of the first and second lead terminals includes an upper conductive layer, a middle conductive layer, and a lower conductive layer disposed on different layers and electrically connected to each other, the lead frame unit includes a first insulating substrate and a second insulating substrate, the upper conductive layer is disposed between the light source unit and the first insulating substrate, the middle conductive layer is disposed between the first insulating substrate and the second insulating substrate, and the lower conductive layer is disposed on the second insulating substrate and disposed on an opposite surface to a surface on which the middle conductive layer is disposed.

摘要：【中文】公开了一种发光二极管封装件。发光二极管封装件包括：引线框架单元；光源单元，设置在所述引线框架单元上；外部框架，设置在所述引线框架单元一侧，其中，所述引线框架单元包括：主体部，具有与所述光源单元接触的第一面、与所述第一面相反的第二面以及连接所述第一面和所述第二面的第三面；第一导电层，设置在所述主体部的所述第一面上；第二导电层，设置在所述主体部的所述第二面上；以及贯通孔，设置在所述第一导电层和所述第二导电层之间，并且贯通所述主体部，其中，所述主体部包括去除所述第二面和所述第三面的一部分而从所述第二面和所述第三面下陷的形状的焊料孔，所述引线框架单元通过设置在所述焊料孔内的焊膏而与所述外部框架连接。 【EN】A light emitting diode package is disclosed. The light emitting diode package includes: a lead frame unit; a light source unit disposed on the lead frame unit; an outer frame disposed at one side of the lead frame unit, wherein the lead frame unit includes: a body portion having a first surface in contact with the light source unit, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface; a first conductive layer provided on the first surface of the main body portion; a second conductive layer disposed on the second surface of the main body portion; and a through hole provided between the first conductive layer and the second conductive layer and penetrating the body portion, wherein the body portion includes a solder hole having a shape depressed from the second surface and the third surface by removing a portion of the second surface and the third surface, and the lead frame unit is connected to the external frame by a solder paste provided in the solder hole.

摘要：【中文】本发明涉及一种发光二极管封装件，包括上部、下部壳体部，上部壳体部包括：第一发光二极管芯片，布置于上部壳体部；第二发光二极管芯片，布置于上部壳体部；第一、第二波长转换部，对应于第一、第二发光二极管芯片，使光通过；第一电极，形成于第一发光二极管芯片；第二电极，形成于第二发光二极管芯片，下部壳体部包括：至少三个槽，形成于下部壳体部；至少三个焊盘，对应于一个槽并覆盖对应槽的至少一部分；第一对通孔，布置为在第二方向上将第一电极连接到一个以上焊盘，第二对通孔，布置为在第二方向上将第二电极连接到一个以上焊盘，其中，第三槽形成于第一对通孔中的一个与第二对通孔中的一个之间的位置。 【EN】The invention relates to a light emitting diode package, comprising an upper housing part and a lower housing part, wherein the upper housing part comprises: a first light emitting diode chip disposed at the upper housing portion; a second light emitting diode chip disposed at the upper housing portion; first and second wavelength conversion parts corresponding to the first and second light emitting diode chips for passing light therethrough; the first electrode is formed on the first light-emitting diode chip; a second electrode formed on the second light emitting diode chip, the lower housing portion including: at least three grooves formed in the lower housing portion; at least three pads corresponding to one of the grooves and covering at least a portion of the corresponding groove; a first pair of vias arranged to connect the first electrode to the one or more pads in the second direction, a second pair of vias arranged to connect the second electrode to the one or more pads in the second direction, wherein a third slot is formed at a location between one of the first pair of vias and one of the second pair of vias.

摘要：【中文】本发明公开了一种提高结合力的箱板纸及其制作工艺，属于造纸技术领域。该箱板纸包括底层和芯层，所述芯层为长纤维层，底层为短纤维层，在芯底层复合面上，长纤维均匀排列构成骨架，短纤维嵌入骨架的间隙中。芯层以长纤维为主，底层以短纤维为主，通过控制芯层长纤维和底层短纤维的比重，在芯底层复合面上，构造出长纤维骨架嵌入短纤维，保证了复合面的结合强度。 【EN】The invention discloses boxboard paper capable of improving binding force and a manufacturing process thereof, and belongs to the technical field of papermaking. The cardboard paper comprises a bottom layer and a core layer, wherein the core layer is a long fiber layer, the bottom layer is a short fiber layer, long fibers are uniformly arranged on a composite surface of the core layer to form a framework, and short fibers are embedded into gaps of the framework. The core layer is mainly made of long fibers, the bottom layer is mainly made of short fibers, and the long fiber framework embedded short fibers are constructed on the composite surface of the core layer and the bottom layer by controlling the specific gravity of the long fibers of the core layer and the short fibers of the bottom layer, so that the bonding strength of the composite surface is ensured.

摘要：【中文】本发明公开了一种用于狭窄空间盾构平面滑行步进的装置，包括弧形导台和导轨，还包括与盾构主机上的推进油缸连接的传力机构和位于盾构主机上用于拉动传力机构的辅助传力机构，所述传力机构包括与推进油缸一端连接的若干传力块、与传力块连接的横梁、位于横梁一侧的反力支架，反力支架的底部与弧形导台连接，反力支架的数量与推进油缸的数量相等，本发明简单实用，利用现有标准块管片等资源，无需单独加工钢结构弧形导台，节省成本；小空间平面滑行，无需扩大滑行通道断面尺寸，减少浅埋段隧道安全风险；支撑受力结构采用H型钢横梁增加支撑受力面积，横梁与反力支架平衡对称传力，操作简便，使用安全。 【EN】The invention discloses a device for shield plane sliding stepping in a narrow space, which comprises an arc-shaped guide table, a guide rail, a force transmission mechanism connected with a thrust oil cylinder on a shield host and an auxiliary force transmission mechanism positioned on the shield host and used for pulling the force transmission mechanism, wherein the force transmission mechanism comprises a plurality of force transmission blocks connected with one end of the thrust oil cylinder, a cross beam connected with the force transmission blocks and a counter-force bracket positioned on one side of the cross beam, the bottom of the counter-force bracket is connected with the arc-shaped guide table, and the number of the counter-force brackets is equal to that of the thrust oil cylinders; the small-space plane slides without enlarging the section size of a sliding channel, and the safety risk of a shallow-buried tunnel is reduced; the supporting stress structure adopts the H-shaped steel beam to increase the supporting stress area, the beam and the counter-force support are in balance and symmetrical force transmission, the operation is simple and convenient, and the use is safe.