摘要：【中文】本发明涉及一种半导体装置封装，其包括衬底、第一绝缘层和电触头。所述第一绝缘层安置于所述衬底的所述第一表面上。所述电触头安置于所述衬底上并且具有被所述第一绝缘层环绕的第一部分和从所述第一绝缘层暴露的第二部分以及在所述电触头的所述第一部分和所述第二部分之间的颈部。此外，所述第二部分从所述颈部逐渐变窄。 【EN】A semiconductor device package includes a substrate, a first insulating layer, and electrical contacts. The first insulating layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulating layer and a second portion exposed from the first insulating layer and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.

摘要：【中文】本申请公开了一种数据处理方法、装置及电子设备，方法包括：获得多个训练对象的工艺数据，所述工艺数据包含工艺标识和至少两项工艺参数，所述工艺标识表征所述训练对象是否为工艺合格的对象；以所述训练对象的工艺数据作为预先构建的工艺预测模型的训练样本，对所述工艺预测模型进行训练，得到训练完成的工艺预测模型；其中，所述工艺质量预测模型用于以待预测的目标对象的工艺数据作为输入，输出所述目标对象的预测结果，所述预测结果至少表征所述目标对象是否工艺合格。 【EN】The application discloses a data processing method, a data processing device and electronic equipment, wherein the method comprises the following steps: the method comprises the steps of obtaining process data of a plurality of training objects, wherein the process data comprise process identification and at least two process parameters, and the process identification represents whether the training objects are qualified objects or not; taking the process data of the training object as a training sample of a pre-constructed process prediction model, and training the process prediction model to obtain a trained process prediction model; the process quality prediction model is used for taking process data of a target object to be predicted as input and outputting a prediction result of the target object, wherein the prediction result at least represents whether the target object is qualified in a process.

摘要：【中文】根据示例实施例的半导体器件包括：衬底，在彼此相交的第一方向和第二方向上延伸；纳米线，在所述衬底上并在所述第二方向上彼此间隔开；栅电极，在所述第一方向上延伸且在所述第二方向上彼此间隔开，并围绕所述纳米线以与所述纳米线竖直地叠置；外部隔墙，在所述衬底上并覆盖所述纳米线上的所述栅电极的侧壁；以及隔离层，在所述栅电极之间并在所述第一方向上延伸，其中，所述隔离层的上表面与所述栅电极的上表面齐平。 【EN】A semiconductor device according to an example embodiment includes: a substrate extending in a first direction and a second direction intersecting each other; nanowires on the substrate and spaced apart from each other in the second direction; gate electrodes extending in the first direction and spaced apart from each other in the second direction and surrounding the nanowire to vertically overlap the nanowire; an outer partition wall on the substrate and covering sidewalls of the gate electrode on the nanowire; and an isolation layer between the gate electrodes and extending in the first direction, wherein an upper surface of the isolation layer is flush with an upper surface of the gate electrode.

摘要：【中文】本说明书涉及包含由式1表示的第一单元和由式2表示的第二单元的聚合物、包含其的涂覆组合物和通过使用其形成的有机发光器件。 【EN】The present specification relates to a polymer including a first unit represented by formula 1 and a second unit represented by formula 2, a coating composition including the same, and an organic light emitting device formed by using the same.

摘要：【中文】本发明公开一种杀菌器及杀菌系统。根据关于杀菌器的一实施例，包括：第一壳体，包括与欲杀菌的区域对置的外表面；第二壳体，与所述第一壳体结合而规定第一壳体内部的空间；照射孔，设置于所述第一壳体；窗部件容纳部，设置在所述照射孔的周边且所述第一壳体的内表面；窗部件，至少一部分安置于所述窗部件容纳部；阶梯部，设置于所述窗部件容纳部的边缘而安置所述窗部件及弹性材料；指示器，设置于所述第二壳体而能够确认杀菌光源是否工作；以及基板，设置在所述第一壳体的内部，并安装有通过所述照射孔照射紫外线的紫外线发光二极管，所述照射孔具备剖面随着从所述第一壳体的内表面朝向外表面而逐渐变宽的照射孔扩张部。 【EN】The invention discloses a sterilizer and a sterilization system. According to an embodiment related to a sterilizer, comprising: a first housing including an outer surface opposite to an area to be sterilized; a second housing coupled to the first housing to define a space inside the first housing; an irradiation hole provided in the first housing; a window member receiving portion provided at a periphery of the irradiation hole and an inner surface of the first housing; a window member at least a portion of which is disposed in the window member receiving portion; a stepped portion provided at an edge of the window member receiving portion to seat the window member and an elastic material; an indicator provided in the second housing and capable of confirming whether the germicidal light source is operating; and a substrate provided inside the first housing and mounted with an ultraviolet light emitting diode that irradiates ultraviolet light through the irradiation hole, wherein the irradiation hole includes an irradiation hole expansion portion whose cross section gradually widens from an inner surface toward an outer surface of the first housing.

摘要：【中文】本发明的热塑性树脂组合物的特征在于包括：热塑性树脂，该热塑性树脂包含橡胶改性的乙烯基类接枝共聚物和芳族乙烯基类共聚物树脂；氧化锌；磷酸锌；表面涂覆的氧化锌，该表面涂覆的氧化锌的表面的部分或整体被磷酸锌涂覆。该热塑性树脂组合物具有卓越的耐酸性和抗菌性能。 【EN】The thermoplastic resin composition of the present invention is characterized by comprising: a thermoplastic resin comprising a rubber-modified vinyl graft copolymer and an aromatic vinyl copolymer resin; zinc oxide; zinc phosphate; surface-coated zinc oxide, a part or the whole of the surface of which is coated with zinc phosphate. The thermoplastic resin composition has excellent acid resistance and antibacterial properties.

摘要：【中文】根据本发明的热塑性树脂组合物包括：橡胶改性的芳族乙烯基类共聚物树脂；脂族聚酰胺树脂；聚(醚酯酰胺)嵌段共聚物；改性的聚烯烃树脂；以及耐热性乙烯基类共聚物树脂。热塑性树脂组合物表现出优异的抗静电性能、耐热性和机械性能。 【EN】The thermoplastic resin composition according to the present invention comprises: a rubber-modified aromatic vinyl copolymer resin; an aliphatic polyamide resin; poly (ether ester amide) block copolymers; a modified polyolefin resin; and a heat-resistant vinyl-based copolymer resin. The thermoplastic resin composition exhibits excellent antistatic properties, heat resistance and mechanical properties.

摘要：【中文】本申请提供一种半导体装置及半导体芯片。半导体装置包含半导体衬底，半导体衬底具有定义于其中的划线。多个半导体芯片形成于半导体衬底的上表面上。至少一个导电结构在其划线内布置在半导体衬底的上表面上。圆角布置在导电结构的至少一个侧表面上。圆角被配置成引发经由导电结构的中心部分沿划线扩散的切割线。 【EN】The application provides a semiconductor device and a semiconductor chip. A semiconductor device includes a semiconductor substrate having a scribe line defined therein. A plurality of semiconductor chips are formed on an upper surface of the semiconductor substrate. At least one conductive structure is disposed on the upper surface of the semiconductor substrate within the scribe line thereof. The rounded corners are disposed on at least one side surface of the conductive structure. The rounded corners are configured to induce a cut line that propagates along the scribe line via a central portion of the conductive structure.

摘要：【中文】本发明的热塑性树脂组合物包括：约100重量份的橡胶改性的芳族乙烯基共聚物树脂；约0.1重量份‑1重量份的吡啶硫酮锌；和约0.1重量份‑10重量份的氧化锌，其中通过粒度分析仪测量的氧化锌的平均粒度(D50)为约0.5μm‑3μm，并且在光致发光的测量期间，370nm‑390nm区的峰A和450nm‑600nm区的峰B的尺寸比(B/A)为约0.01‑1.0。热塑性树脂组合物具有优异的耐候性、抗菌性能、机械性能等。 【EN】The thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a rubber-modified aromatic vinyl copolymer resin; about 0.1 to about 1 part by weight of zinc pyrithione; and about 0.1 to 10 parts by weight of zinc oxide, wherein the average particle size (D50) of the zinc oxide measured by a particle size analyzer is about 0.5 to 3 μm, and the size ratio (B/A) of a peak A in a region of 370 to 390nm and a peak B in a region of 450 to 600nm during measurement of photoluminescence is about 0.01 to 1.0. The thermoplastic resin composition has excellent weather resistance, antibacterial property, mechanical property and the like.

摘要：【中文】本发明的热塑性树脂组合物的特征在于包括：热塑性树脂，该热塑性树脂包含橡胶改性的乙烯基类接枝共聚物和芳族乙烯基类共聚物树脂；聚亚烷基二醇；氧化锌，该氧化锌具有约0.5μm至约3μm的平均粒度和约1m²/g至约10m²/g的比表面积BET；以及磷酸锌。该热塑性树脂组合物和由其形成的模塑制品即使在暴露于电离辐射之后也具有优异的耐变色性、抗菌性能和耐酸性。 【EN】The thermoplastic resin composition of the present invention is characterized by comprising: a thermoplastic resin comprising a rubber-modified vinyl graft copolymer and an aromatic vinyl copolymer resin; a polyalkylene glycol; zinc oxide having an average particle size of about 0.5 to about 3 μm and about 1m²Per g to about10m²A specific surface area BET per g; and zinc phosphate. The thermoplastic resin composition and molded articles formed therefrom have excellent discoloration resistance, antibacterial properties, and acid resistance even after exposure to ionizing radiation.