摘要：【中文】本发明公开了一种3‑三氟烷基喹喔啉酮化合物的制备方法。具体包括以下操作步骤：在反应瓶中加入原料喹啉啉酮、烯烃和三氟甲基亚磺酸钠，然后加入氧化剂过二硫酸钾，最后加入有机溶剂与水的混合溶剂。反应混合物在60‑100℃下反应24小时。终止反应后，浓缩反应液，柱层析分离得到3‑三氟烷基喹喔啉酮化合物。本方法具有步骤少、反应效率高、操作简便和无金属残留污染等优点。 【EN】The invention discloses a preparation method of a 3-trifluoroalkyl quinoxalinone compound. The method specifically comprises the following operation steps: the raw materials of quinolinone, olefin and sodium trifluoromethanesulfonate are added into a reaction bottle, then potassium peroxodisulfate serving as an oxidant is added, and finally a mixed solvent of an organic solvent and water is added. The reaction mixture was reacted at 60-100 ℃ for 24 hours. After the reaction is terminated, the reaction solution is concentrated and separated by column chromatography to obtain the 3-trifluoroalkyl quinoxalinone compound. The method has the advantages of few steps, high reaction efficiency, simple and convenient operation, no metal residue pollution and the like.

摘要：【中文】本发明公开了制备3‑酰基喹喔啉酮的方法，尤其是一种利用光催化技术制备3‑酰基喹喔啉酮化合物方法。具体包括以下步骤：在反应器中加入2‑（1H）喹啉啉酮、酮酸和光催化剂，然后加入有机溶剂混合，在室温可见光照下反应6‑8小时。反应终止后，浓缩反应液，柱层析分离得到3‑酰基喹喔啉酮化合物。本方法具有以下显著的优点：简便的操作步骤，温和的反应条件，清洁的可见光能，空气为绿色氧化剂，原料简单易得，反应安全性好。 【EN】The invention discloses a method for preparing 3-acyl quinoxalinone, in particular to a method for preparing 3-acyl quinoxalinone compounds by utilizing a photocatalysis technology. The method specifically comprises the following steps: adding 2- (1H) quinolinone, keto acid and photocatalyst into a reactor, then adding an organic solvent for mixing, and reacting for 6-8 hours under the visible light irradiation at room temperature. After the reaction is finished, the reaction liquid is concentrated and separated by column chromatography to obtain the 3-acyl quinoxalinone compound. The method has the following remarkable advantages: simple and convenient operation steps, mild reaction conditions, clean visible light energy, green oxidant in air, simple and easily obtained raw materials and good reaction safety.

摘要：【中文】本发明提供了一种利用成丝效应切割透明材料的工艺及系统，利用超快激光在透明材料中传输时产生的一种非线性光学现象，引起的自聚焦与弱电离产生的等离子体散焦之间的动态平衡形成长距离的窄光束，同时通过对光束能量和长度的控制，可以实现对玻璃、蓝宝石等透明脆性材料的精细加工。使用超快激光器加工蓝宝石，基本没有微裂纹，崩边小且断面粗糙度小，同时加工速度快。加工带油墨的蓝宝石热影响小，且边缘油墨不成锯齿状。 【EN】The invention provides a process and a system for cutting a transparent material by utilizing a filamentation effect, wherein a nonlinear optical phenomenon generated when ultrafast laser is transmitted in the transparent material is utilized, the dynamic balance between self-focusing and plasma defocusing generated by weak ionization is caused to form a long-distance narrow light beam, and meanwhile, the fine processing of the transparent brittle materials such as glass, sapphire and the like can be realized by controlling the energy and the length of the light beam. The ultra-fast laser is used for processing the sapphire, basically has no microcrack, small broken edge and small section roughness, and has high processing speed. The heat influence of the sapphire with the ink is small, and the ink on the edge is not jagged.

摘要：【中文】半导体封装件包括：第一管芯，具有第一衬底；互连结构，位于第一衬底上面并且具有多个金属层以及连接多个金属层的通孔；密封环结构，位于第一衬底上面并且沿着第一衬底的外围，密封环结构具有多个金属层以及连接多个金属层的通孔，该密封环结构具有最顶部金属层，最顶部金属层是最远离第一衬底的密封环结构的金属层，密封环结构的最顶部金属层具有内金属结构和外金属结构；以及聚合物层，位于密封环结构上方，该聚合物层具有最外边缘，该最外边缘位于密封环结构的外金属结构的顶面上方并且与密封环结构的外金属结构的顶面对准。本发明的实施例还涉及半导体封装件的形成方法。 【EN】The semiconductor package includes: a first die having a first substrate; an interconnect structure located over the first substrate and having a plurality of metal layers and vias connecting the plurality of metal layers; a seal ring structure located above and along a periphery of the first substrate, the seal ring structure having a plurality of metal layers and vias connecting the plurality of metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure; and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with the top surface of the outer metal structure of the seal ring structure. Embodiments of the present invention also relate to methods of forming semiconductor packages.

摘要：【中文】本发明涉及一种脆性材料激光切割装置及方法，包括激光器、扩束系统、光阑孔、锥透镜、准直透镜以及物镜；激光器能够输出高斯激光光束，扩束系统、光阑孔、锥透镜、准直透镜以及物镜被设置在激光的光路上；输出的高斯激光光束依次射入扩束系统和光阑孔，高斯激光光束经过该扩束系统扩束，将激光光斑直径扩大；再经过光阑孔，控制光斑的能量分布；再经过锥透镜将高斯激光光束转换成贝塞尔激光光束，再射入准直透镜，形成环形光，再经过物镜聚焦，形成聚焦后贝塞尔激光光束作用在脆性材料上进行切割操作。利用本发明的激光切割装置在满足脆性材料的切断面的粗糙度要求同时也能满足对激光强度的控制要求，切割出合适形状的切断面粗糙度的脆性材料。 【EN】The invention relates to a brittle material laser cutting device and a brittle material laser cutting method, wherein the brittle material laser cutting device comprises a laser, a beam expanding system, a diaphragm hole, a conical lens, a collimating lens and an objective lens; the laser can output Gaussian laser beams, and the beam expanding system, the diaphragm hole, the conical lens, the collimating lens and the objective lens are arranged on a laser light path; the output Gaussian laser beam is sequentially emitted into a beam expanding system and a diaphragm hole, and the Gaussian laser beam is expanded by the beam expanding system to expand the diameter of a laser spot; then the light beam passes through a diaphragm hole to control the energy distribution of the light spots; and the focused Bessel laser beam acts on the brittle material to perform cutting operation. The laser cutting device of the invention can meet the requirements of the roughness of the cut surface of the brittle material and the control requirement of the laser intensity, and cut the brittle material with the cut surface roughness of a proper shape.