摘要：【中文】本发明提供一种LED封装结构及其制造方法，该结构包括：不透光的基板、第一透光层和多个芯片；各个芯片固定于基板上，且被第一透光层覆盖；在每个芯片中，芯片设置电极的面为电极面，芯片的电极面背向基板，且芯片的电极面70％以上的面积不透光，与电极面相对的面为出光面；两个电极之间相距预置距离，且电极通过焊线连接至基板上的线路层。本发明通过将多个芯片设置于不透光的基板上，并用透光层将各个芯片覆盖起来，由于芯片的电极所在面为非透光面，且两个电极之间相互隔开，可利用较大的电极面积将电极通过焊线连接至线路层上，便于芯片的贴装，能够降低LED封装结构的成本和生产难度，提高背光源发光均匀度。 【EN】The invention provides an LED packaging structure and a manufacturing method thereof, wherein the structure comprises the following components: the chip comprises a light-tight substrate, a first light-tight layer and a plurality of chips; each chip is fixed on the substrate and covered by the first light-transmitting layer; in each chip, the surface of the chip, provided with the electrodes, is an electrode surface, the electrode surface of the chip is opposite to the substrate, more than 70% of the area of the electrode surface of the chip is light-proof, and the surface opposite to the electrode surface is a light-emitting surface; the two electrodes are separated by a preset distance and connected to the circuit layer on the substrate through bonding wires. According to the LED packaging structure, the plurality of chips are arranged on the lighttight substrate, the chips are covered by the lighttight layer, the surfaces of the electrodes of the chips are non-lighttight surfaces, the two electrodes are mutually separated, the electrodes can be connected to the circuit layer through the bonding wires by using a larger electrode area, the chip mounting is facilitated, the cost and the production difficulty of the LED packaging structure can be reduced, and the light emitting uniformity of the backlight source is improved.

摘要：【中文】本发明提供了一种LED外延片及其制备方法，包括：提供衬底；对所述衬底进行加热，并采用氮化气体对所述衬底进行氮化处理，以在所述衬底表面形成翘曲控制层，其中所述氮化气体至少包括氨气；在所述翘曲控制层表面依次形成N型半导体层、多量子阱层和P型半导体层。对衬底进行加热，并采用氮化气体对衬底进行氮化处理，使得氨气与衬底表面的一些化学键结合，形成晶格常数介于衬底和半导体层中间的物质即翘曲控制层，减少衬底和半导体层之间因晶格失配产生的压应力或张应力，进而减小和改变LED外延片的翘曲，提高LED外延片的波长均匀性，提高LED外延片的良率，节约后续形成的LED芯片的分选成本。 【EN】The invention provides an LED epitaxial wafer and a preparation method thereof, wherein the preparation method comprises the following steps: providing a substrate; heating the substrate, and carrying out nitridation treatment on the substrate by using nitridation gas to form a warpage control layer on the surface of the substrate, wherein the nitridation gas at least comprises ammonia gas; and sequentially forming an N-type semiconductor layer, a multi-quantum well layer and a P-type semiconductor layer on the surface of the warping control layer. The substrate is heated, and nitriding gas is adopted to conduct nitriding treatment on the substrate, so that ammonia gas is combined with chemical bonds on the surface of the substrate to form a material with a lattice constant between the substrate and a semiconductor layer, namely a warping control layer, the compressive stress or tensile stress generated between the substrate and the semiconductor layer due to lattice mismatch is reduced, the warping of the LED epitaxial wafer is reduced and changed, the wavelength uniformity of the LED epitaxial wafer is improved, the yield of the LED epitaxial wafer is improved, and the sorting cost of subsequently formed LED chips is saved.

摘要：【中文】本申请涉及一种计量设备检修处理方法、装置、计算机设备和存储介质。所述方法包括：获取待检修的故障计量设备的设备信息；对设备信息进行故障分析，得到故障计量设备的故障信息和故障信息对应的检修信息；当检修信息的类型为远程调试类型时，将故障信息和检修信息发送至远程检修员标识对应的远程检修终端；故障信息和检修信息用于指示远程检修终端对故障计量设备进行远程故障调试；获取远程故障调试的调试结果，当调试结果为检修失败时，生成故障计量设备的现场检修工单；将现场检修工单发送至现场检修员标识对应的现场检修终端；现场检修工单用于指示现场检修终端对故障计量设备进行现场故障调试。采用本方法能够提高计量设备的检修效率。 【EN】The application relates to a metering equipment maintenance processing method and device, computer equipment and a storage medium. The method comprises the following steps: acquiring equipment information of fault metering equipment to be overhauled; analyzing the equipment information to obtain fault information of the fault metering equipment and maintenance information corresponding to the fault information; when the type of the overhaul information is a remote debugging type, sending the fault information and the overhaul information to a remote overhaul terminal corresponding to the remote overhaul personnel identifier; the fault information and the maintenance information are used for indicating the remote maintenance terminal to carry out remote fault debugging on the fault metering equipment; acquiring a debugging result of remote fault debugging, and generating a field maintenance work order of the fault metering equipment when the debugging result is maintenance failure; sending the on-site maintenance work order to an on-site maintenance terminal corresponding to the on-site maintenance worker identification; and the field maintenance work order is used for indicating the field maintenance terminal to carry out field fault debugging on the fault metering equipment. By adopting the method, the maintenance efficiency of the metering equipment can be improved.

摘要：【中文】本申请实施例提供了一种LED芯片及其制作方法，该LED芯片包括：衬底、缓冲层、N型氮化镓层、多量子阱发光层、空穴注入层，其中，空穴注入层包括层叠的AlInGaN层、含镁材料层和P型AlInGaN层，其中，含镁材料层中镁的电离能较低，激活效率较高，可以对AlInGaN层和P型AlInGaN层进行镁浓度的补充，提高AlInGaN层和P型AlInGaN层中镁的掺杂浓度，从而有利于提高整个空穴注入层的空穴浓度，便于更多的空穴向多量子阱发光层注入，以使得空穴注入层在提高多量子阱发光层中的空穴浓度的基础上，不会吸收过多的多量子阱发光层中发出的光线，提高LED芯片的发光亮度。 【EN】The embodiment of the application provides an LED chip and a manufacturing method thereof, wherein the LED chip comprises: the substrate, the buffer layer, N type gallium nitride layer, the multiple quantum well luminescent layer, the hole injection layer, wherein, the hole injection layer is including the AlInGaN layer of range upon range of, contain magnesium material layer and P type AlInGaN layer, wherein, the ionization energy of magnesium is lower in the magnesium material layer, activation efficiency is higher, can carry out magnesium concentration's replenishment to AlInGaN layer and P type AlInGaN layer, improve the doping concentration of magnesium in AlInGaN layer and the P type AlInGaN layer, thereby be favorable to improving the hole concentration of whole hole injection layer, be convenient for more holes to multiple quantum well luminescent layer injection, so that the hole injection layer is on the basis of the hole concentration in the multiple quantum well luminescent layer of improvement, can not absorb the light that sends in the too much multiple quantum well luminescent layer, improve the luminous luminance of LED chip.

摘要：【中文】本发明提供了一种空调水系统应急自动排水装置及其控制方法，所述自动排水装置包括：蓄电池、控制器和排水阀，所述控制器和排水阀均与蓄电池连接；其中在空调电源正常通电时，若采用所述空调电源作为所述控制器和/或排水阀的电源进行供电，则当空调电源断电后，将所述控制器和/或排水阀的电源由所述空调电源切换至所述蓄电池，并通过所述控制器控制所述排水阀进行空调水系统排水。 【EN】The invention provides an emergency automatic drainage device of an air conditioner water system and a control method thereof, wherein the automatic drainage device comprises: the controller and the drain valve are connected with the storage battery; when the air conditioner power supply is normally powered on, if the air conditioner power supply is adopted as the power supply of the controller and/or the drain valve for power supply, after the power supply of the air conditioner is powered off, the power supply of the controller and/or the drain valve is switched to the storage battery by the air conditioner power supply, and the drain valve is controlled by the controller to drain water of the air conditioner water system.

摘要：【中文】本发明提供的一种LED封装结构及其制造方法，其中，该结构包括：透光基板、封装胶层和多个芯片；各个芯片固定于透光基板上，且被封装胶层覆盖；在每个芯片中，芯片靠近透光基板的面为出光面，出光面相背的面为电极面，电极面上设置有至少两个电极，电极之间相距预置距离，且电极通过焊线连接至透光基板上的线路层。本发明通过将多个芯片设置于透光基板上，并用封装胶层将各个芯片覆盖起来，使得芯片的出光面朝向基板，且由于芯片两个隔开的电极在与出光面相对的面上，可以利用较大的电极面积将电极通过焊线连接至线路层上，便于芯片的贴装，且焊接难度大大降低，对基板的精度、应力适配问题的要求不高，能够降低LED封装结构的成本和生产难度。 【EN】The invention provides an LED packaging structure and a manufacturing method thereof, wherein the structure comprises: the packaging structure comprises a light-transmitting substrate, a packaging adhesive layer and a plurality of chips; each chip is fixed on the light-transmitting substrate and covered by the packaging adhesive layer; in each chip, the surface of the chip close to the light-transmitting substrate is a light-emitting surface, the surface opposite to the light-emitting surface is an electrode surface, at least two electrodes are arranged on the electrode surface, the electrodes are separated by a preset distance, and the electrodes are connected to the circuit layer on the light-transmitting substrate through bonding wires. According to the LED packaging structure, the plurality of chips are arranged on the light-transmitting substrate, and the packaging adhesive layer covers each chip, so that the light-emitting surface of each chip faces the substrate, and because the two separated electrodes of each chip are arranged on the surface opposite to the light-emitting surface, the electrodes can be connected to the circuit layer through the bonding wires by utilizing a larger electrode area, the chip can be conveniently mounted, the welding difficulty is greatly reduced, the requirements on the accuracy and stress adaptation problem of the substrate are not high, and the cost and the production difficulty of the LED packaging structure can be reduced.

摘要：【中文】本发明涉及一种反射透射式两用光弹仪，包括：一支架导轨，所述支架导轨由依次连接的第一支架导轨、第二支架导轨及第三支架导轨组成，所述第二支架导轨位于中间，所述第一支架导轨与第三支架导轨可调整角度的连接在所述第二支架导轨的两端；多个旋转镜架，用于安装1/4波片或偏振光源或偏振片，分别可调位置的安装在所述第一支架导轨与第三支架导轨上；一加载装置，用于装夹待测试件，可拆卸的安装在所述第二支架导轨上。与现有技术相比，本发明装置既可以作为透射式光弹仪，又可以作为反射式光弹仪。 【EN】The invention relates to a reflection-transmission type dual-purpose photoelastic instrument, comprising: the support guide rail consists of a first support guide rail, a second support guide rail and a third support guide rail which are sequentially connected, the second support guide rail is positioned in the middle, and the first support guide rail and the third support guide rail are connected to the two ends of the second support guide rail in an angle-adjustable manner; the plurality of rotating mirror frames are used for mounting 1/4 wave plates or polarized light sources or polaroids and are respectively mounted on the first support guide rail and the third support guide rail in an adjustable position; and the loading device is used for clamping the piece to be tested and is detachably arranged on the second bracket guide rail. Compared with the prior art, the device can be used as a transmission type photoelastic instrument and a reflection type photoelastic instrument.

摘要：【中文】本公开提出一种美颜处理方法及装置，其中，方法包括：获取原始人脸图像，提取与美颜部位的部位特征对应的原始参数信息；根据原始参数信息确定与美颜部位对应的部位美颜参数；根据部位美颜参数对美颜部位进行处理，生成目标人脸图像。由此，能够生成个性化的美颜参数，满足用户个性化的美颜需求，提高美颜参数精准度，提高美颜效果。 【EN】The present disclosure provides a beauty treatment method and device, wherein the method comprises: acquiring an original face image, and extracting original parameter information corresponding to the part characteristics of the beautifying part; determining a part beautifying parameter corresponding to the beautifying part according to the original parameter information; and processing the beautifying part according to the part beautifying parameter to generate a target face image. Therefore, personalized beauty parameters can be generated, the personalized beauty requirements of users are met, the precision of the beauty parameters is improved, and the beauty effect is improved.

摘要：【中文】本发明涉及一种大转角塔跨越封网专用支架，其特征在于：包括支架本体及安装在支架本体中心位置处的吊装环，所述吊装环包括竖直板及与竖直板焊接安装的八字形角钢板，所述竖直板上设置有吊装孔，所述吊装环通过八字形角钢板与所述支架本体螺栓固定连接；所述支架本体的两端分别对称设置有左挂板及右挂板，所述左挂板及右挂板上下两端均设置有若干挂点；所述支架本体上对称设置有坐凳板及脚踏板，所述坐凳板与所述支架本体侧面通过螺栓固定，所述脚踏板与所述支架本体通过螺栓固定。本发明设计科学合理，大大地减轻了施工强度，减少人力机械的使用，同时安全可靠，操作简便，而且人性化，将在今后的施工起到较大的作用。 【EN】The invention relates to a special support for spanning and net sealing of a large-angle tower, which is characterized in that: the lifting ring comprises a bracket body and a lifting ring arranged at the central position of the bracket body, wherein the lifting ring comprises a vertical plate and a splayed angle steel plate welded and arranged with the vertical plate, a lifting hole is formed in the vertical plate, and the lifting ring is fixedly connected with the bracket body through the splayed angle steel plate; the two ends of the bracket body are respectively and symmetrically provided with a left hanging plate and a right hanging plate, and the upper end and the lower end of each of the left hanging plate and the right hanging plate are respectively provided with a plurality of hanging points; the stool plate and the pedal are symmetrically arranged on the support body, the stool plate and the side face of the support body are fixed through bolts, and the pedal and the support body are fixed through bolts. The invention has scientific and reasonable design, greatly reduces the construction strength, reduces the use of manpower and machinery, is safe and reliable, has simple and convenient operation and humanization, and plays a great role in the future construction.

摘要：【中文】本发明涉及一种高通量快速评价和/或筛选耐盐碱植物的方法，其包括如下步骤：1)获得受试植物的离体枝条，得到受试材料；2)将所述受试材料置于盐和/或碱的溶液中进行处理，得到处理材料；同时将所述受试材料置于清水中进行处理，得到空白对照材料；3)测定所述处理材料和所述空白对照材料的叶绿素含量和/或叶绿素荧光参数；4)比较所述处理材料的叶绿素含量和/或叶绿素荧光参数和所述空白对照材料的叶绿素含量和/或叶绿素荧光参数。 【EN】The invention relates to a method for quickly evaluating and/or screening saline-alkali tolerant plants in high throughput, which comprises the following steps: 1) obtaining an isolated branch of a tested plant to obtain a tested material; 2) placing the tested material in a solution of salt and/or alkali for treatment to obtain a treated material; meanwhile, the tested material is placed in clear water for processing, and a blank control material is obtained; 3) determining the chlorophyll content and/or chlorophyll fluorescence parameters of the treated material and the blank control material; 4) comparing the chlorophyll content and/or chlorophyll fluorescence parameter of the treated material with the chlorophyll content and/or chlorophyll fluorescence parameter of the blank control material.