当前查询到77条专利与查询词 "Xu Xiaoting"相关,搜索用时0.2812634秒!排序方式:
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申请号:201810968814.2 公开号:CN110859029A 主分类号:H05K3/38
摘要:【中文】本发明提出一种柔性电路板的制作方法,其包括以下步骤:提供一基底;通过涂布方式在基底的相对两个表面上涂布一接着溶液并经干燥处理形成两个接着层,接着溶液含有接着剂及溶剂,接着溶液的黏度为5000毫帕·秒;在每个接着层背离基底的表面上分别形成第一铜层与第二铜层;蚀刻第一铜层和第二铜层以分别形成第一信号线路层和第二信号线路层;以及在第一信号线路层和第二信号线路层的表面上分别包覆绝缘层。上述制作方法制备的柔性电路板介质损耗低。另外,本发明还提供一种柔性电路板。 【EN】The invention provides a manufacturing method of a flexible circuit board, which comprises the following steps: providing a substrate; coating an adhesive solution on two opposite surfaces of the substrate in a coating mode and drying to form two adhesive layers, wherein the adhesive solution contains an adhesive and a solvent, and the viscosity of the adhesive solution is 5000 mPa.s; respectively forming a first copper layer and a second copper layer on the surface of each adhesion layer departing from the substrate; etching the first copper layer and the second copper layer to form a first signal line layer and a second signal line layer, respectively; and respectively coating insulating layers on the surfaces of the first signal circuit layer and the second signal circuit layer. The flexible circuit board prepared by the manufacturing method has low dielectric loss. In addition, the invention also provides a flexible circuit board.
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申请号:201811012480.8 公开号:CN110876226A 主分类号:H05K1/02
摘要:【中文】一种软硬结合电路板,包括:一柔性的基层;至少一第一线路层,所述第一线路层设置于所述基层的其中一表面上;至少一绝缘层,所述绝缘层设置于所述第一线路层远离所述基层的表面;至少一第二线路层,所述第二线路层设置于所述绝缘层远离所述基层的表面;至少一导电柱,所述导电柱电性连接所述第一线路层及所述第二线路层;以及,所述软硬结合电路板还包括软板区和硬板区,所述绝缘层设置于所述硬板区内,所述绝缘层的材质为聚醚醚酮。本发明还提供一种软性软硬结合电路板的制作方法。 【EN】A rigid-flex circuit board comprising: a flexible substrate; the first circuit layer is arranged on one surface of the base layer; the insulating layer is arranged on the surface, far away from the base layer, of the first circuit layer; the second circuit layer is arranged on the surface, far away from the base layer, of the insulating layer; at least one conductive column electrically connected to the first circuit layer and the second circuit layer; the flexible-rigid combined circuit board further comprises a flexible board area and a rigid board area, the insulating layer is arranged in the rigid board area, and the insulating layer is made of polyether-ether-ketone. The invention also provides a manufacturing method of the soft and hard combined circuit board.
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申请号:201811152665.9 公开号:CN110972389A 主分类号:H05K1/02
摘要:【中文】一种电路板,所述电路板包括线路层,设置于所述线路层一侧的保护层以及设置于所述保护层远离所述线路层一侧的屏蔽层,所述电路板还包括多个电子元件及多个屏蔽单元,所述电子元件与所述线路层电性连接,每个所述电子元件周围设置有至少一个贯穿所述保护层并使所述线路层裸露的连接孔,每个所述屏蔽单元覆盖至少一个电子元件裸露的表面,每个所述屏蔽单元通过所述连接孔与所述线路层电性连接,每个所述屏蔽单元与所述屏蔽层电性连接。 【EN】The utility model provides a circuit board, the circuit board includes the circuit layer, set up in the protective layer of circuit layer one side and set up in the protective layer is kept away from the shielding layer of circuit layer one side, the circuit board still includes a plurality of electronic component and a plurality of shielding unit, electronic component with circuit layer electric connection, every be provided with at least one around the electronic component and run through the protective layer makes the naked connecting hole of circuit layer, every the shielding unit covers the naked surface of at least one electronic component, every the shielding unit passes through the connecting hole with circuit layer electric connection, every the shielding unit with shielding layer electric connection.
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申请号:201911371297.1 公开号:CN111222978A 主分类号:G06Q40/02
摘要:【中文】本发明公开了一种电力交易履约风险管控方法,包括以下步骤:提交申请资料;资料审核,确定是否具有交易资格;符合条件的用户,继续提交保证凭证;根据提交的保证凭证,确定用户的可使用额度、信用分以及信用等级;对用户使用金额进行监控;将使用金额与可使用额度进行对比,确定是否继续交易。本发明,可对个人用户或企业用户进行风险评估,评估方法简单、可靠;因为本申请用户所使用额度最终会小于用户本身的资产,所以不用担心用户无力偿还的问题,且采用用户优先充值模式;即使出现用户使用额度大于授权额度的情况,后台可及时监控,避免超额太多,从而使风险可控;采用信用评级,用户围栏确保自身信用等级不降低,从而会履行交易规则。 【EN】The invention discloses a method for managing and controlling electric power transaction performance risk, which comprises the following steps: submitting application data; data auditing, namely determining whether the transaction is qualified; the users meeting the conditions continue to submit the guarantee voucher; determining the available limit, credit score and credit level of the user according to the submitted guarantee voucher; monitoring the use amount of money of the user; and comparing the use amount with the available amount to determine whether to continue the transaction. According to the invention, risk assessment can be carried out on individual users or enterprise users, and the assessment method is simple and reliable; because the using amount of the user is smaller than the assets of the user, the user does not worry about the problem of incapability of paying, and a user priority recharging mode is adopted; even if the use limit of the user is larger than the authorized limit, the background can monitor in time, and the excessive use is avoided, so that the risk is controllable; with credit rating, the user fence ensures that the credit rating itself does not decrease, thereby fulfilling the transaction rules.
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申请号:201811436350.7 公开号:CN111246663A 主分类号:H05K1/16
摘要:【中文】一种内埋电阻结构的制作方法,包括步骤:提供一基材层;通过化学镀方式在所述基材层的上形成一电阻材料层;在所述电阻材料层的远离所述基材层的表面上形成一镀铜层,得到一内埋电阻结构中间体;所述镀铜层包括一第一导电线路及一第二导电线路,所述电阻材料层从所述第一导电线路及第二导电线路之间裸露出来;在所述镀铜层上形成一防镀膜层,所述防镀膜层覆盖所述第一导电线路与第二导电线路之间的电阻材料层;及通过化学试剂蚀刻掉未被覆盖的所述电阻材料层,并移除所述防镀膜层。本发明还涉及一种内埋电阻结构。 【EN】A manufacturing method of an embedded resistor structure comprises the following steps: providing a substrate layer; forming a resistance material layer on the base material layer in a chemical plating mode; forming a copper plating layer on the surface of the resistance material layer far away from the base material layer to obtain an embedded resistance structure intermediate; the copper plating layer comprises a first conductive circuit and a second conductive circuit, and the resistance material layer is exposed out of the space between the first conductive circuit and the second conductive circuit; forming an anti-plating film layer on the copper plating layer, wherein the anti-plating film layer covers the resistance material layer between the first conductive circuit and the second conductive circuit; and etching away the uncovered resistance material layer by using a chemical agent, and removing the anti-plating film layer. The invention also relates to an embedded resistor structure.
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申请号:201811437520.3 公开号:CN111246684A 主分类号:H05K3/38
摘要:【中文】本发明提供一种电路板,包括绝缘基底,两个分别设于所述绝缘基底两侧的线路层,以及两个分别覆盖于对应所述线路层上的保护层,所述绝缘基底上设有至少两个通孔,所述绝缘基底的相对两侧的部分区域以及所述通孔的内壁形成改质层,所述改质层上沉积有金属层,所述线路层设于所述金属层上,其中一个所述线路层上设有至少两个接触垫,对应的所述保护层上设有开口以裸露所述接触垫,所述接触垫上贴装被动元件。所述线路层的截面呈椭圆形,其截面积大于常规制程而形成的线路的截面积,而截面积越大,载流量越大,有助于信号的高频传输。本发明还提供一种上述电路板的制作方法。 【EN】The invention provides a circuit board which comprises an insulating substrate, two circuit layers and two protective layers, wherein the two circuit layers are respectively arranged on two sides of the insulating substrate, the two protective layers are respectively covered on the corresponding circuit layers, at least two through holes are formed in the insulating substrate, modified layers are formed in partial areas of two opposite sides of the insulating substrate and the inner walls of the through holes, metal layers are deposited on the modified layers, the circuit layers are arranged on the metal layers, at least two contact pads are arranged on one circuit layer, openings are formed in the corresponding protective layers to expose the contact pads, and passive elements are pasted on the contact pads. The cross section of the circuit layer is elliptic, the cross section of the circuit layer is larger than that of a circuit formed by a conventional process, and the larger the cross section is, the larger the current-carrying capacity is, so that the high-frequency transmission of signals is facilitated. The invention also provides a manufacturing method of the circuit board.
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申请号:201811352339.2 公开号:CN111186903A 主分类号:C02F3/10
摘要:【中文】本发明涉及水、废水和污水的生物处理,尤其是一种用于高盐废水挂膜的新型生物填料。一种用于高盐废水挂膜的新型生物填料,它由耐高盐的化学纤维构成的外丝和中心绳编织而成,可耐受5%的高盐浓度,保证在此浓度条件下外丝和中心绳不断裂、不腐蚀、依然附着大量微生物,保持稳定结构。通常的化学纤维材料具有强度高、耐磨、弹性好等优点,但其缺点是耐光和耐候性差,耐高盐度差。本发明通过对这些化学纤维材料的物理和化学性能的改性,改变了部分物理和化学性能,提高了耐盐度,使其可耐受5%高盐浓度,保证在此浓度条件下外丝和中心绳不断裂,不腐蚀,依然附着大量微生物,保持稳定结构。从而大大提高了这种新型生物填料的生物处理效果。 【EN】The invention relates to biological treatment of water, wastewater and sewage, in particular to a novel biological filler for high-salinity wastewater biofilm formation. The novel biological filler for high-salt wastewater biofilm formation is formed by weaving outer threads and a central rope, wherein the outer threads and the central rope are formed by high-salt-resistant chemical fibers, can resist high salt concentration of 5 percent, ensure that the outer threads and the central rope are not fractured or corroded under the condition of the high salt concentration, still attach a large amount of microorganisms and keep a stable structure. The common chemical fiber material has the advantages of high strength, wear resistance, good elasticity and the like, but has the defects of poor light resistance and weather resistance and poor high salinity resistance. The invention changes partial physical and chemical properties by modifying the physical and chemical properties of the chemical fiber materials, improves the salinity resistance, ensures that the outer thread and the central rope are not broken and corroded under the condition of the high salinity resistance of 5 percent, still adheres to a large amount of microorganisms and keeps a stable structure. Thereby greatly improving the biological treatment effect of the novel biological filler.
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申请号:201910965193.7 公开号:CN111190047A 主分类号:G01R19/25
摘要:【中文】本发明提出一种电流采集诊断电路,包括电流信号输入端CH1、采样单元、信号放大单元和模拟信号数字信号转换器ADC,其特征是,所述信号放大单元包括若干并联的信号调理运算放大器,所述信号放大单元还并接有电流源,所述电流信号输入端CH1接有检测单元,检测单元接于模拟信号数字信号转换器ADC。还提出对此电路的失效诊断方法,包括对开关SW1、开关SW18和开关SW3进行失效诊断;对模拟信号数据信号转换器ADC、信号调理运放OP1和信号调理运放OP2进行失效诊断;对电源I1和开关SW17进行失效诊断;对采样电阻R1和采样电阻R9进行失效诊断。本发明具有较高的自我诊断功能,能够检测电流采集电路中所有器件的失效,诊断覆盖率高。 【EN】The invention provides a current acquisition diagnosis circuit which comprises a current signal input end CH1, a sampling unit, a signal amplification unit and an analog signal digital signal converter ADC and is characterized in that the signal amplification unit comprises a plurality of signal conditioning operational amplifiers which are connected in parallel, the signal amplification unit is also connected with a current source in parallel, the current signal input end CH1 is connected with a detection unit, and the detection unit is connected with the analog signal digital signal converter ADC. A failure diagnosis method for this circuit is also proposed, including performing failure diagnosis for the switch SW1, the switch SW18, and the switch SW 3; carrying out failure diagnosis on the analog signal data signal converter ADC, the signal conditioning operational amplifier OP1 and the signal conditioning operational amplifier OP 2; performing failure diagnosis on the power supply I1 and the switch SW 17; and carrying out failure diagnosis on the sampling resistor R1 and the sampling resistor R9. The invention has higher self-diagnosis function, can detect the failure of all devices in the current acquisition circuit and has high diagnosis coverage rate.
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申请号:201911187673.1 公开号:CN111070634A 主分类号:B29C48/88
摘要:【中文】本发明公开了一种双侧开启的塑料挤出成型用的冷却水箱,属于塑料挤出领域,水箱箱体的两端两侧设置有连接箱体与水箱上板的连接装置,连接装置包括连接杆和弹簧,水箱上板的纵向侧面固连有向水箱上板侧面伸出的延长块,延长块与弹簧的一端部铰接,弹簧的另一端与连接杆铰接,连接杆的另一端与水箱上板边缘铰接,箱体沿口下方固接有固定块,固定块上开设有U形槽,连接杆上固接有承重销,使得水箱上板盖住箱体时承重销位于固定块上的U形槽底。本发明的有益效果是可以从水箱两侧都可以打开水箱上板,实现开启,大大降低了操作人员的劳动强度,对于一人管理左右两条生产线尤为合适,提高了生产效率。 【EN】The invention discloses a cooling water tank for plastic extrusion molding with double-side opening, which belongs to the field of plastic extrusion. The invention has the advantages that the upper plate of the water tank can be opened from both sides of the water tank, so that the opening is realized, the labor intensity of operators is greatly reduced, the invention is particularly suitable for one person to manage a left production line and a right production line, and the production efficiency is improved.
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申请号:201911146433.7 公开号:CN111129941A 主分类号:H01S5/02
申请人:【中文】东南大学【EN】SOUTHEAST University 申请日:2019.11.21 公开日:2020.05.08
摘要:【中文】本发明公开了一种硅基集成激光器芯片倒装耦合结构,该结构的左侧为有源激光器芯片,该结构的右侧为无源硅基芯片,无源硅基芯片的左侧开有沟槽,有源激光器芯片通过倒装在该沟槽内与无源硅基芯片实现键合;无源硅基芯片中设有绝缘体上硅,绝缘体上硅的外延部分作为光的耦合与接收通道;有源激光器芯片的顶层和底层设有与电极相连的金属接触;有源激光器芯片作为激励源发光,光通过倏逝场耦合进入绝缘体上硅的外延通道内形成光场传输。本发明能够实现有源器件与无源器件的高效光耦合,为大规模光子集成技术奠定基础。 【EN】The invention discloses a flip-chip coupling structure of a silicon-based integrated laser chip, wherein an active laser chip is arranged on the left side of the structure, a passive silicon-based chip is arranged on the right side of the structure, a groove is formed in the left side of the passive silicon-based chip, and the active laser chip is bonded with the passive silicon-based chip by being inversely arranged in the groove; the passive silicon-based chip is internally provided with silicon-on-insulator, and an epitaxial part of the silicon-on-insulator is used as a coupling and receiving channel of light; the top layer and the bottom layer of the active laser chip are provided with metal contacts connected with the electrodes; the active laser chip is used as an excitation source to emit light, and the light enters an epitaxial channel of the silicon-on-insulator through evanescent field coupling to form optical field transmission. The invention can realize the high-efficiency optical coupling of the active device and the passive device and lays a foundation for the large-scale photon integration technology.
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