摘要：【中文】一种桑树皮纤维混纺纱线的环保染色方法，由于桑树皮纤维的强度不高，故本发明将其与竹纤维混纺加捻，提升纤维的强度，然后使用生物酶处理混纺纱线，由于生物酶对纱线作用比较缓和，不会使纤维强度降低太多，同时也有利于提升后续天然染料的染色效果；在染色过程中加入了少量助染剂，不但可以显著提升天然染料的染色效果，而且可以不再使用元明粉，且浴比低，符合国家对纺织行业的环保要求；本发明的桑树皮纤维混纺纱线的环保染色方法，不但染色效果好，而且得到的混纺纤维耐磨性能好，不易起毛起球，显著提升了纱线的经济价值。 【EN】The invention relates to an environment-friendly dyeing method of mulberry bark fiber blended yarns, which comprises the steps of blending and twisting mulberry bark fibers and bamboo fibers to improve the strength of the fibers due to low strength of the mulberry bark fibers, and then treating the blended yarns by using biological enzyme, wherein the biological enzyme has mild action on the yarns, so that the fiber strength is not reduced too much, and the dyeing effect of subsequent natural dyes is also favorably improved; a small amount of dyeing assistant is added in the dyeing process, so that the dyeing effect of natural dye can be obviously improved, anhydrous sodium sulphate can be not used any more, the bath ratio is low, and the national environmental protection requirement on the textile industry is met; the environment-friendly dyeing method of the mulberry bark fiber blended yarn has the advantages that the dyeing effect is good, the obtained blended fiber has good wear resistance, fluffing and pilling are not easy to occur, and the economic value of the yarn is remarkably improved.

摘要：【中文】本发明涉及一种电脑桌，尤其涉及一种方便调节显示器的电脑桌。要解决的技术问题是如何提供一种可以快速方便调节电脑显示器位置、根据情况移动机箱的方便调节显示器的电脑桌。一种方便调节显示器的电脑桌，包括有滑槽垫板、支撑架、安装框、后支架、移动组件、放置组件、固定组件等；滑槽垫板顶部均设有支撑架，支撑架之间设有安装框，安装框后侧设有后支架，支撑架与滑槽垫板之间设有通过滑动方式对进行移动的移动组件，安装框内设有放置组件。本发明通过移动组件和放置组件配合，可以快速的调节电脑左右移动到合适位置，通过橡胶棒和空心杆配合，可以在工作的过程中，有效的防止电脑被碰撞时进行移动。 【EN】The invention relates to a computer desk, in particular to a computer desk with a display convenient to adjust. The technical problem to be solved is how to provide a computer desk which can quickly and conveniently adjust the position of a computer display and can move a case according to the situation and conveniently adjust the display. A computer desk convenient for adjusting a display comprises a sliding chute base plate, a supporting frame, a mounting frame, a rear support, a moving assembly, a placing assembly, a fixing assembly and the like; the spout backing plate top all is equipped with the support frame, is equipped with the installing frame between the support frame, and the installing frame rear side is equipped with the after-poppet, is equipped with through the removal subassembly that the slip mode removed between support frame and the spout backing plate, is equipped with in the installing frame and places the subassembly. According to the invention, the computer can be quickly adjusted to move left and right to a proper position by matching the moving assembly with the placing assembly, and the computer can be effectively prevented from moving when being collided in the working process by matching the rubber rod with the hollow rod.

摘要：【中文】本申请公开了立体陶基线路板，包括陶瓷基体，陶瓷基体中部沿其纵向方向开设有用于通风散热的纵向散热通孔，且其周侧表面开设有多个朝内凹陷的内凹槽，两相紧邻的内凹槽间形成有用于覆布金属的金属覆布部，金属覆布部上覆布有金属线路层，陶瓷基体前后侧均设有与金属线路层连接且用于连接电源的电源连接线路层。本申请通过多个内凹槽形成多个金属覆布部，继而当在金属覆布部设置有金属线路层以及在陶瓷基体1前后两侧设有与金属线路层连接并用于连接电源的电源连接线路层则可实现线路的导通，另外，通过纵向散热通孔还可实现中空通风以加快陶瓷基体的整一降温散热效果，以及进一步满足实际使用需求。 【EN】The application discloses three-dimensional pottery base circuit board, including the ceramic base body, ceramic base body middle part is offered along its longitudinal direction and is used for ventilation cooling's vertical heat dissipation through-hole, and its week side surface has seted up a plurality of sunken inner groves inwards, be formed with the metal portion of covering cloth that is used for covering cloth metal between the inner grove of double-phase next-door neighbour, the metal portion of covering cloth covers cloth and coats cloth and have the metallic wiring layer that has, the side all is equipped with the power supply connection circuit layer that is connected and is used for connecting the power with the metallic wiring layer around the ceramic. This application forms a plurality of metal cover cloth portions through a plurality of indent grooves, then is provided with the metallic interconnect layer and is equipped with the power supply connection circuit layer that is connected with the metallic interconnect layer and is used for being connected the power around ceramic base member 1 when the metal cover cloth portion then can realize switching on of circuit, in addition, still can realize the whole cooling radiating effect of cavity ventilation in order to accelerate ceramic base member through vertical heat dissipation through-hole to and further satisfy the in-service use demand.

摘要：【中文】本申请公开了加厚安装位PCB，包括PCB基体，所述PCB基体上设有加厚安装位，所述加厚安装位下侧向下凸出，且其上侧向上凸起，以及在其上开设有上下贯通以用于连接的连接过孔。本申请加厚安装位PCB通过在所述PCB基体上设置有上下两侧相背凸出且具有所述连接过孔的所述加厚安装位以实现解决现有较薄PCB在连接安装时容易出现脆裂的技术问题，继而不仅可达提高PCB的实用性和适用性，且还可大大提高PCB的连接安装稳定性，进而有利于进一步提高PCB的技术发展。 【EN】The application discloses thickening installation position PCB, including the PCB base member, be equipped with thickening installation position on the PCB base member, thickening installation position downside is protrusion downwards, and on it the side direction on the protrusion to and link up the connection via hole in order to be used for connecting about having seted up on it. This application thickening installation position PCB passes through both sides are mutually carried on the back of the body the protrusion and have about being provided with on the PCB base member connect the via hole thickening installation position is in order to realize solving current thinner PCB and appear brittle failure's technical problem when connecting the installation easily, then not only can reach the practicality and the suitability that improve PCB, and still can improve PCB's connection installation stability greatly, and then be favorable to further improving PCB's technical development.

摘要：【中文】本申请涉及PCB板技术领域，尤其涉及点触式隔热PCB板，包括PCB板本体，所述PCB板本体的四周均匀设有多个向下凸起的凸柱，所述凸柱向下的截面面积逐渐减小，所述PCB板本体的中部设有向下凸起的安装顶座，所述凸柱凸起的高度高于所述安装顶座凸起的高度，所述安装顶座开设有上下贯通的安装通孔。本申请提供的点触式隔热PCB板，由于所述凸柱与所述安装顶座的高度差，PCB板锁紧时中部会微微下凹，PCB板本身的弹性作用下起到预紧的效果；另外所述凸柱向下的截面面积逐渐减小，在保证支撑强度的前提下大大减小了导热面的接触面积，降低了导热速度，增强隔热效果。 【EN】The utility model relates to a PCB board technical field especially relates to point-contact thermal-insulated PCB board, including the PCB board body, evenly be equipped with a plurality of downward bellied projections around the PCB board body, the decurrent cross sectional area of projection reduces gradually, the middle part of the PCB board body is equipped with downward bellied mount pad, the bellied height of projection is higher than the bellied height of mount pad, the mount pad sets up the mounting through-hole that link up from top to bottom. According to the point-contact heat-insulation PCB, due to the height difference between the convex column and the mounting top seat, the middle part of the PCB is slightly concave when the PCB is locked, and the pre-tightening effect is achieved under the elastic action of the PCB; in addition, the area of the downward section of the convex column is gradually reduced, so that the contact area of the heat conducting surface is greatly reduced on the premise of ensuring the supporting strength, the heat conducting speed is reduced, and the heat insulation effect is enhanced.

摘要：【中文】本申请公开了PCB沉铜孔的高精密加工方法，包括步骤：S1，采用机械手夹持限位板组且装夹于电脑锣设备工作台上；S2，采用机械手夹持加工参考板且下放于限位板组上；S3，采用电脑锣设备上加工主轴所设有的视觉传感器对加工参考板扫描，且通过配合位置调整机构及夹紧夹具对加工参考板进行位置调整和夹紧操作；S4，通过视觉传感器识别加工参考板上的锣孔位置，而后再通过锣刀锣孔；S5，锣孔加工完毕后，采用设置于电脑锣设备上的检测探针进行检测判别锣孔的加工尺寸；S6，当锣孔的加工品质被判定为合格时，则卸出加工参考板，随后再将夹持待加工PCB且下放至限位板组上，而后再重复S3和S4；S7，待加工PCB上锣孔加工完毕后，则可卸出且放置至指定地点。 【EN】The application discloses a high-precision processing method of a PCB copper-sinking hole, which comprises the following steps: s1, clamping the limiting plate set by a manipulator and assembling and clamping the limiting plate set on a computer gong equipment workbench; s2, clamping the processing reference plate by a manipulator and putting the processing reference plate down on the limiting plate group; s3, scanning the processing reference plate by adopting a visual sensor arranged on a processing main shaft on computer gong equipment, and carrying out position adjustment and clamping operation on the processing reference plate by matching a position adjusting mechanism and a clamping fixture; s4, recognizing the routing position on the processing reference plate through a visual sensor, and routing through a routing knife; s5, after the milling of the milling hole is finished, detecting and judging the processing size of the milling hole by using a detection probe arranged on computer milling equipment; s6, when the machining quality of the routing holes is judged to be qualified, the machining reference plate is unloaded, then the PCB to be machined is clamped and is placed on the limiting plate group, and then S3 and S4 are repeated; and S7, after the routing on the PCB is finished, the PCB can be detached and placed to a designated place.

摘要：【中文】本申请公开了三维陶瓷电路基板，包括陶瓷基体，陶瓷基体下部周侧且向外凸出的凸出部，凸出部上开设有金属化上下贯通孔；陶瓷基体上部下侧面设有第一线路连接层，且其上部上侧设有第二线路连接层，以及在其上部上还开设有上下贯通并与第一线路连接层和第二线路连接层连接的金属化连接孔；陶瓷基体中部周侧设有向下延伸连接金属化上下贯通孔以及向上延伸连接第一线路连接层的中间连接线路条。本申请通过金属化上下贯通孔连接电源，随之通过中间连接线路条连接第一线路连接层，而后在通过金属化上下贯通孔连通第二线路连接层以使陶瓷基体可实现三维立体的电路基板，继而方便在陶瓷基体上侧面连接电元器件，从而可达三维立体线路的应用需求。 【EN】The application discloses a three-dimensional ceramic circuit substrate, which comprises a ceramic substrate, a bulge part and a circuit board, wherein the bulge part is arranged on the periphery of the lower part of the ceramic substrate and protrudes outwards, and a metalized upper through hole and a metalized lower through hole are formed in the bulge part; the lower side surface of the upper part of the ceramic substrate is provided with a first circuit connecting layer, the upper side of the upper part of the ceramic substrate is provided with a second circuit connecting layer, and the upper part of the ceramic substrate is also provided with a metalized connecting hole which is vertically communicated and is connected with the first circuit connecting layer and the second circuit connecting layer; the periphery of the middle part of the ceramic substrate is provided with an intermediate connecting line strip which extends downwards to connect the metalized upper and lower through holes and extends upwards to connect the first line connecting layer. This application is through the perforating hole connection power about the metallization, connects first circuit connection layer through intermediate junction line way strip thereupon, then through the metallization about perforating hole intercommunication second circuit connection layer so that ceramic base member can realize three-dimensional circuit substrate, then conveniently side connection electrical components spare on ceramic base member to can reach the application demand of three-dimensional circuit.

摘要：【中文】本申请涉及PCB技术领域，尤其涉及模块化立体式PCB模组，包括围设形成散热通道的多个PCB板，所述散热通道一端设有用于将所述散热通道内的空气抽出的散热风扇，所述散热风扇上设有安装座。本申请提供的模块化立体式PCB模组，所述PCB板工作时产生的热量被散热风扇集中带走，散热效率更高，且围设的PCB板比平铺的更加节省空间。 【EN】The utility model relates to a PCB technical field especially relates to three-dimensional PCB module of modularization, including enclosing a plurality of PCB boards of establishing formation heat dissipation channel, heat dissipation channel one end be equipped with be used for with radiator fan that the air in the heat dissipation channel was taken out, the last mount pad that is equipped with of radiator fan. The application provides a three-dimensional PCB module of modularization, the heat that the PCB board during operation produced is concentrated by radiator fan and is taken away, and the radiating efficiency is higher, and encloses the PCB board of establishing and save space more than tiling.

摘要：【中文】本申请公开了可平整断开废料边的PCB，包括PCB基体，以及至少设于PCB基体一侧的包边料条，PCB基体邻近于包边料条的一侧开设有第一填料槽孔，第一填料槽孔内填设有第一金属模块；包边料条上开设有与第一填料槽孔对应设置的第二填料槽孔，第二填料槽孔内填设有第二金属模块；第一金属模块与第二金属模块间设有间隔连接条。本申请当掰断包边料条时，则可通过间隔连接条和第二金属模块相配合以实现减弱PCB基体与包边料条的连接强度，继而当掰断包边料条后，则可使得PCB基体上邻近包边料条的一侧出现平整的断面，且还可保证第一金属模块可稳固的固设于PCB基体上，进而可达大幅度提高PCB的品质目的。 【EN】The application discloses a PCB capable of flatly breaking waste edges, which comprises a PCB base body and an edge covering material strip at least arranged on one side of the PCB base body, wherein a first filler slotted hole is formed in one side, adjacent to the edge covering material strip, of the PCB base body, and a first metal module is filled in the first filler slotted hole; a second filler slot hole corresponding to the first filler slot hole is formed in the edge covering material strip, and a second metal module is filled in the second filler slot hole; and a spacing connecting strip is arranged between the first metal module and the second metal module. This application is when breaking disconnected material strip of borduring off with the fingers and thumb, then accessible interval connecting strip and second metal module cooperate in order to realize weakening the PCB base member and the joint strength who bordures the material strip, then after breaking disconnected material strip of borduring off with the fingers and thumb, then can make on the PCB base member neighbouring one side of borduring the material strip appear smooth section, and still can guarantee that first metal module can stabilize set firmly on the PCB base member, and then can reach the quality purpose that increases substantially PCB.

摘要：【中文】本申请涉及PCB技术领域，尤其涉及高隔热立体式PCB模组，包括安装座，所述安装座中空且其中空位置设有散热风扇，围绕所述散热风扇一周设置有安装围板，沿所述安装围板围设有多个PCB板，多个PCB板围设形成散热通道；所述PCB板在与所述安装围板之间设有至少两个第一隔热支脚，以使所述PCB板与所述安装围板之间形成间隔，且所述第一隔热支脚自PCB板到安装围板方向的截面面积逐渐减小。本申请提供的高隔热立体式PCB模组，散热效率更高，且围设的PCB板比平铺的更加节省空间；另外，散热风扇工作时产生的热量通过第一隔热支脚传递，而第一隔热支脚的端部截面面积小，在保证支撑强度的前提下大大减小了导热面的接触面积，降低了导热速度，增强隔热效果。 【EN】The application relates to the technical field of PCBs (printed circuit boards), in particular to a high-heat-insulation three-dimensional PCB module which comprises a mounting seat, wherein the mounting seat is hollow, a radiating fan is arranged in the hollow position of the mounting seat, a mounting enclosing plate is arranged around the radiating fan, a plurality of PCB boards are arranged along the mounting enclosing plate in an enclosing manner, and a radiating channel is formed by the plurality of PCB boards in an enclosing manner; the PCB board with be equipped with two at least first thermal-insulated stabilizer blades between the installation bounding wall, so that the PCB board with form the interval between the installation bounding wall, just first thermal-insulated stabilizer blade reduces gradually from the cross sectional area of PCB board to installation bounding wall direction. The high-heat-insulation three-dimensional PCB module is higher in heat dissipation efficiency, and the enclosed PCB is more space-saving than a tiled PCB; in addition, the heat that radiator fan during operation produced passes through first thermal-insulated stabilizer blade transmission, and the tip cross sectional area of first thermal-insulated stabilizer blade is little, has reduced the area of contact of heat-conducting surface greatly under the prerequisite of guaranteeing to support intensity, has reduced heat conduction speed, reinforcing thermal-insulated effect.