摘要：【中文】本发明公开了一种建模与协同优化方法，该方法包括如下步骤：建立具有统一语言、统一规范和标准的业务流程模型；基于不同的运行场景对业务流程进行仿真运行；依据具有统一语言、统一规范和标准的业务流程模型发布业务流程；运行业务流程；对业务流程模型与运行数据的关联性进行分析；优化业务流程的运行。该方法采用集中式流程管理的思想，通过与信息系统建设的结合，支持企业级业务流程的按需设计、灵活定义、快速调整；有利于构建自动化、集中式、系统性的流程监管手段；建立企业管理模式变革的正向设计与逆向反馈的信息化长效机制，有效提升企业智慧化管理水平。 【EN】The invention discloses a modeling and collaborative optimization method, which comprises the following steps: establishing a business process model with uniform language, uniform specification and standard; performing simulation operation on the service flow based on different operation scenes; issuing a business process according to a business process model with uniform language, uniform specification and standard; operating a business process; analyzing the relevance of the business process model and the operation data; and optimizing the operation of the business process. The method adopts the idea of centralized flow management, and supports the design, flexible definition and quick adjustment of enterprise-level business flow according to the requirements by combining with the construction of an information system; the method is beneficial to constructing an automatic, centralized and systematic flow supervision means; an informatization long-acting mechanism of forward design and reverse feedback of enterprise management mode change is established, and the intelligent management level of enterprises is effectively improved.

摘要：【中文】本发明提供一种激光加工实时检测装置，包括：激光器，用于发出对工件进行加工的激光束；光束调节单元，用于通过旋转控制所述激光束的方向；反射镜，用于改变所述激光束的传播方向；检测单元，用于实时检测所述工件的表面状态；以及聚焦镜头，用于对所述激光束进行聚焦，以使所述激光束垂直射出并聚焦至所述激光束。本发明还提供一种激光加工实时检测方法。上述的激光加工实时检测装置及方法在激光器与反光镜之间设置光束调节单元，通过旋转光束调节单元来调整激光器发出激光束的传播方向，实现了不同方向加工时总可以保证激光光斑和CCD相机中心的相对移动方向不变，从而有效实现边加工边检测，结构简单，调节方便。 【EN】The invention provides a laser processing real-time detection device, comprising: a laser for emitting a laser beam for processing a workpiece; a beam adjusting unit for controlling a direction of the laser beam by rotation; a mirror for changing a propagation direction of the laser beam; the detection unit is used for detecting the surface state of the workpiece in real time; and the focusing lens is used for focusing the laser beam so as to enable the laser beam to vertically emit and focus to the laser beam. The invention also provides a real-time detection method for laser processing. According to the laser processing real-time detection device and method, the light beam adjusting unit is arranged between the laser and the reflector, the propagation direction of the laser beam emitted by the laser is adjusted by rotating the light beam adjusting unit, and the relative movement direction of the laser spot and the CCD camera center is always unchanged during processing in different directions, so that processing and detection are effectively realized, the structure is simple, and the adjustment is convenient.

摘要：【中文】本发明涉及一种激光修复微型LED的装置和方法，装置包括：加工平台、视觉系统、第一激光器、第二激光器、搬运系统以及测试系统；加工平台用于放置待修复样品，通过移动加工平台以调整待修复样品的位置；视觉系统用于识别待修复样品中的不良芯粒；第一激光器用于发射激光去除不良芯粒并对不良芯粒对应的基板上的焊盘进行清洁；搬运系统用于给焊盘上锡，并用于拾取新的芯粒放置于焊盘上；第二激光器用于发射激光融化新的芯粒电极与焊盘接触处的锡；测试系统用于检测修复完成的样品的修复效果。该装置可有效精确更换微型LED中的不良芯粒，实现微型LED的修复，且维修效率高。 【EN】The invention relates to a device and a method for repairing a micro LED by laser, wherein the device comprises: the system comprises a processing platform, a vision system, a first laser, a second laser, a carrying system and a testing system; the processing platform is used for placing a sample to be repaired and adjusting the position of the sample to be repaired by moving the processing platform; the vision system is used for identifying bad core particles in the sample to be repaired; the first laser is used for emitting laser to remove the bad core particles and cleaning the bonding pads on the substrate corresponding to the bad core particles; the carrying system is used for tinning the bonding pad and picking up a new core particle to be placed on the bonding pad; the second laser is used for emitting laser to melt tin at the contact position of the new core particle electrode and the welding pad; the test system is used for detecting the repairing effect of the repaired sample. The device can effectively and accurately replace poor core particles in the miniature LED, realizes the repair of the miniature LED and has high maintenance efficiency.

摘要：【中文】本发明公开了一种激光切割方法，包括如下步骤：将被切割件放置于切割平台，并保持相对固定；获取所述被切割件的预设切割线位置；根据所述预设切割线位置，将两激光束依次沿所述被切割件的预设切割线进行激光切割，其一所述激光束波长为8‑15μm，另一所述激光束波长为0.2‑0.4μm。同时，本发明也公开了一种能够实施上述激光切割方法的激光切割系统。在本发明技术方案中，两激光束依次对所述被切割件的预设切割线进行激光切割，优势互补，用以实现灵活切割，保证切割产品质量，同时，提高切割工作效率。 【EN】The invention discloses a laser cutting method, which comprises the following steps: placing the cut piece on a cutting platform and keeping the cut piece relatively fixed; acquiring a preset cutting line position of the cut piece; and according to the position of the preset cutting line, sequentially carrying out laser cutting on two laser beams along the preset cutting line of the cut piece, wherein the wavelength of one laser beam is 8-15 mu m, and the wavelength of the other laser beam is 0.2-0.4 mu m. Meanwhile, the invention also discloses a laser cutting system capable of implementing the laser cutting method. In the technical scheme of the invention, the two laser beams carry out laser cutting on the preset cutting line of the cut piece in sequence, the advantages are complementary, the flexible cutting is realized, the quality of a cut product is ensured, and meanwhile, the cutting work efficiency is improved.

摘要：【中文】本发明公开了一种激光切割方法，属于激光加工技术领域，包括如下步骤：将被切割件放置于切割平台，并保持相对固定；控制激光器发射激光束，所述激光束的波长为8‑15μm；将所述激光束向所述被切割件的预设切割线的任一侧区域倾斜，并沿所述预设切割线进行激光切割。本发明技术方案提出了所述被切割件以及作用于所述被切割件上的激光切割方法，使得所述被切割件沿切割线形成大小不一的两侧热影响区域，其中，小面积热影响区域的一侧为所述被切割件要保留的重要部分，将切割影响降至最低，保护了所述被切割件。同时，本发明也公开了一种用以实施所述激光切割方法的激光切割装置。 【EN】The invention discloses a laser cutting method, which belongs to the technical field of laser processing and comprises the following steps: placing the cut piece on a cutting platform and keeping the cut piece relatively fixed; controlling a laser to emit laser beams, wherein the wavelength of the laser beams is 8-15 mu m; and inclining the laser beam to any side area of a preset cutting line of the cut piece, and carrying out laser cutting along the preset cutting line. The technical scheme of the invention provides the cut piece and a laser cutting method acting on the cut piece, so that the cut piece forms two heat affected areas with different sizes along a cutting line, wherein one side of the small-area heat affected area is an important part to be reserved for the cut piece, the cutting influence is reduced to the minimum, and the cut piece is protected. Meanwhile, the invention also discloses a laser cutting device for implementing the laser cutting method.

摘要：【中文】本发明公开了一种激光加工系统，包括激光器、光闸组件及控制器；所述激光器用以发射激光束，所述激光束作用于被加工件，以进行激光加工；所述光闸组件在所述激光束光路上设置，包括挡光部，所述挡光部可转动设置，用以通行或阻断所述激光束；所述控制器控制所述挡光部转动，以控制所述激光束的通行或阻断时间，以使所述激光束间隔地作用于所述被加工件。所述光闸组件中的挡光部可转动设置，用以通行或阻断所述激光器发射的激光束，所述激光束可选择性地进行激光加工，提高了加工效率。其中，所述挡光部通行或阻断所述激光束时间由所述控制器控制所述挡光部转动而实现，实现激光加工自动化、精准化。同时，本发明也公开了一种激光加工方法。 【EN】The invention discloses a laser processing system, which comprises a laser, an optical gate assembly and a controller, wherein the optical gate assembly comprises a laser body and a laser beam source; the laser is used for emitting laser beams, and the laser beams act on a processed piece to carry out laser processing; the optical shutter assembly is arranged on the laser beam light path and comprises a light blocking part, and the light blocking part can be arranged in a rotating mode and is used for passing or blocking the laser beam; the controller controls the light blocking part to rotate so as to control the passing or blocking time of the laser beam, so that the laser beam acts on the processed workpiece at intervals. The light blocking part in the optical shutter assembly is rotatably arranged and used for passing or blocking the laser beam emitted by the laser, and the laser beam can be selectively subjected to laser processing, so that the processing efficiency is improved. The controller controls the light blocking part to rotate to realize the passing or blocking of the laser beam time of the light blocking part, and the automation and the precision of laser processing are realized. Meanwhile, the invention also discloses a laser processing method.

摘要：【中文】本发明公开了一种激光切割方法，应用于多层复合材料的切割作业，包括如下步骤：将被切割件固定放置于切割平台；控制激光器发射激光束，其中，所述激光器输出功率为15‑50W,输出脉冲频率为200‑2000kHz,所述激光束波长为243‑455nm；将所述激光束沿所述被切割件的预设切割线进行激光切割，其中，切割速度为100‑500mm/s。同时，本发明也公开了一种能够实施上述激光切割方法的激光切割装置。在本发明技术方案中，采用激光切割的方法，控制激光切割加工工艺参数，使得所述被切割件沿切割线两侧的热影响区域受热升温不高，热影响小，热量能够及时地被释放，避免出现因为层与层之间的粘着性降低而导致熔融杂质渗入层与层之间，造成切割成品质量差的现象。 【EN】The invention discloses a laser cutting method, which is applied to the cutting operation of multilayer composite materials and comprises the following steps: fixedly placing a cut piece on a cutting platform; controlling a laser to emit laser beams, wherein the output power of the laser is 15-50W, the output pulse frequency is 200-2000kHz, and the wavelength of the laser beams is 243-455 nm; and carrying out laser cutting on the laser beam along a preset cutting line of the piece to be cut, wherein the cutting speed is 100-500 mm/s. Meanwhile, the invention also discloses a laser cutting device capable of implementing the laser cutting method. In the technical scheme of the invention, the laser cutting method is adopted to control the laser cutting processing technological parameters, so that the temperature of the cut piece is not high along the heat affected zone at two sides of the cutting line, the heat effect is small, the heat can be released in time, and the phenomenon of poor quality of the cut finished product caused by the fact that the fusion impurities permeate between layers due to the reduction of the adhesiveness between the layers is avoided.

摘要：【中文】本发明涉及一种微型LED的清洁装置及清洁方法，包括激光器，用于发射去除芯粒的激光束；调节光阑，用于调节激光束的光斑尺寸；视觉机构，用于寻找和识别待修复芯粒；以及控制器，用于控制激光器、调节光阑和视觉机构，控制器的输出端连接于激光器、调节光阑的输入端，控制器与视觉机构通讯连接。通过设置清洁装置及清洁方法，当小尺寸和小间距的微型LED出现粒芯异常时，可以进行有效的清洁，从而提高生产良率。 【EN】The invention relates to a cleaning device and a cleaning method of a miniature LED, comprising a laser, a cleaning device and a cleaning device, wherein the laser is used for emitting a laser beam for removing core particles; the adjusting diaphragm is used for adjusting the spot size of the laser beam; the vision mechanism is used for searching and identifying the core particles to be repaired; and the controller is used for controlling the laser, the adjusting diaphragm and the visual mechanism, the output end of the controller is connected with the input ends of the laser and the adjusting diaphragm, and the controller is in communication connection with the visual mechanism. By the cleaning device and the cleaning method, when the miniature LEDs with small sizes and small spacing have abnormal grain cores, the miniature LEDs can be effectively cleaned, so that the production yield is improved.