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申请号:201810964603.1 公开号:CN110858681A 主分类号:H01Q1/38
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2018.08.23 公开日:2020.03.03
摘要:【中文】本发明涉及一种具有可重构谐波抑制功能的双极化三频段的频率可重构天线,包括上层介质基板和下层介质基板,上层天线可重构辐射单元,下层天线可重构辐射单元,上层可重构滤波结构,下层可重构滤波结构,实现了三频段的频率可重构和天线极化可重构,同时也实现了在天线工作工作在不同的频段时,各个频段的谐波的到了抑制同时不影响其他频段的正常工作。 【EN】The invention relates to a dual-polarized three-frequency-band frequency reconfigurable antenna with a reconfigurable harmonic suppression function, which comprises an upper-layer dielectric substrate, a lower-layer dielectric substrate, an upper-layer antenna reconfigurable radiation unit, a lower-layer antenna reconfigurable radiation unit, an upper-layer reconfigurable filtering structure and a lower-layer reconfigurable filtering structure, thereby realizing the frequency reconfiguration and the antenna polarization reconfiguration of three frequency bands, and simultaneously realizing that when the antenna works in different frequency bands, the harmonic of each frequency band is suppressed and the normal work of other frequency bands is not influenced.
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申请号:201910856444.8 公开号:CN110854496A 主分类号:H01P5/10
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.09.11 公开日:2020.02.28
摘要:【中文】本发明一种基于硅通孔的紧凑三维马相巴伦,从上往下依次为顶层输入信号线、顶层第五介质层、顶层第二接地层、顶层第四介质层、顶层第三介质层、顶层第二介质层、顶层第一接地层、顶层第一介质层、硅衬底、底层第一介质层、底层第一接地层、底层第二介质层、底层第三介质层、底层第四介质层、底层第二接地层、底层第五介质层、底层输出第一信号线和底层输出第二信号线。本发明公开的一种基于硅通孔的紧凑三维马相巴伦,具有以下有益效果:1、结构紧凑、占用面积小;2、容易加工;3、与周围其它元件或模块之间的耦合噪声弱;4、寄生参数较小,损耗小;5、易于与其它层或模块元件互连并实现微波系统的三维集成化。 【EN】The invention relates to a compact three-dimensional Murph balun based on a through silicon via, which sequentially comprises a top layer input signal line, a top layer fifth dielectric layer, a top layer second grounding layer, a top layer fourth dielectric layer, a top layer third dielectric layer, a top layer second dielectric layer, a top layer first grounding layer, a top layer first dielectric layer, a silicon substrate, a bottom layer first dielectric layer, a bottom layer first grounding layer, a bottom layer second dielectric layer, a bottom layer third dielectric layer, a bottom layer fourth dielectric layer, a bottom layer second grounding layer, a bottom layer fifth dielectric layer, a bottom layer output first signal line and a bottom layer output second signal line from top to bottom. The invention discloses a compact three-dimensional Murphy balun based on a through silicon via, which has the following beneficial effects: 1. the structure is compact, and the occupied area is small; 2. the processing is easy; 3. the coupling noise with other surrounding elements or modules is weak; 4. parasitic parameters are small, and loss is small; 5. it is easy to interconnect with other layers or module elements and realizes three-dimensional integration of the microwave system.
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申请号:201910898430.2 公开号:CN110849510A 主分类号:G01L1/12
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.09.23 公开日:2020.02.28
摘要:【中文】本发明涉及利用磁性纳米片制作压力应力传感器技术领域,具体公开了一种兼具仿生结构、高弹性、高灵敏度、快速响应回复的压力应力传感器的制备方法,包括如下工艺:首先将水溶性的Co通过溶液反应制备出氢氧化钴,然后将得到的产物在还原剂水合肼的作用下得到Co纳米片,将Co纳米片放入设计好的模具中,然后加入PDMS混合液凝固后加装电极得到目标传感器;本发明使用的原料来源广泛,价格低廉,其具有独特的仿生结构,器件响应快,兼具高柔弹性、高灵敏度,并且制作工艺简单,并且上述制备方法制备的压力应力传感器可用于人造电子皮肤的压力应力的传感。 【EN】The invention relates to the technical field of manufacturing a pressure stress sensor by using magnetic nanosheets, and particularly discloses a preparation method of a pressure stress sensor with a bionic structure, high elasticity, high sensitivity and quick response and recovery, which comprises the following processes: firstly, preparing cobalt hydroxide by carrying out solution reaction on water-soluble Co, then obtaining Co nanosheets from the obtained product under the action of a reducing agent hydrazine hydrate, putting the Co nanosheets into a designed mold, adding PDMS (polydimethylsiloxane) mixed liquid for solidification, and then adding electrodes to obtain a target sensor; the pressure stress sensor prepared by the preparation method can be used for sensing the pressure stress of artificial electronic skin.
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申请号:201910925921.1 公开号:CN110854900A 主分类号:H02J3/38
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.09.27 公开日:2020.02.28
摘要:【中文】本发明涉及一种多能量源协同获取的功率点跟踪电路,包括升压功率级电路和第一功率点跟踪电路,其中,升压功率级电路的第一输入端连接第一能量源的输出端,升压功率级电路的第二输入端连接第二能量源的输出端,升压功率级电路用于将第一能量源和第二能量源的工作周期穿插结合以交替获取第一能量源和第二能量源的输入能量;第一功率点跟踪电路连接升压功率级电路,用于对升压功率级电路的输出功率点进行控制,使升压功率级电路以第一功率点输出能量。该电路采用升压功率级电路,可以利用非连续导通模式的空闲时间,将不同的能量源的工作周期结合起来,实现了多种能量源的同时工作且互不干扰。 【EN】The invention relates to a power point tracking circuit cooperatively obtained by multiple energy sources, which comprises a boosting power level circuit and a first power point tracking circuit, wherein the first input end of the boosting power level circuit is connected with the output end of a first energy source, the second input end of the boosting power level circuit is connected with the output end of a second energy source, and the boosting power level circuit is used for alternately combining the working periods of the first energy source and the second energy source to alternately obtain the input energy of the first energy source and the second energy source; the first power point tracking circuit is connected with the boosting power level circuit and used for controlling an output power point of the boosting power level circuit so that the boosting power level circuit outputs energy at the first power point. The circuit adopts a boosting power stage circuit, can combine the working periods of different energy sources by utilizing the idle time of a discontinuous conduction mode, and realizes the simultaneous working of multiple energy sources without mutual interference.
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申请号:201910942378.6 公开号:CN110852158A 主分类号:G06K9/00
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.09.30 公开日:2020.02.28
摘要:【中文】本发明属于雷达技术领域,具体涉及一种基于模型融合的雷达人体运动状态分类算法及系统,方法包括:获得训练集;根据所述训练集构建支持向量机模型;根据所述支持向量机模型得到所述支持向量机模型的预测值;根据所述支持向量机模型的预测值构建极限梯度提升树模型。本发明通过stacking模型融合方法对支持向量机模型和极限梯度提升树模型进行融合,支持向量机模型适合处理小样本高纬度,极限梯度提升树模型具有拟合能力强的优点,融合后的模型兼具支持向量机模型与极限梯度提升树模型的优点,使得模型泛化能力更强,识别精度更高,减少了深度学习中,对模型训练的时间。 【EN】The invention belongs to the technical field of radars, and particularly relates to a radar human motion state classification algorithm and system based on model fusion, wherein the method comprises the following steps: obtaining a training set; constructing a support vector machine model according to the training set; obtaining a predicted value of the support vector machine model according to the support vector machine model; and constructing a limit gradient lifting tree model according to the predicted value of the support vector machine model. According to the method, the support vector machine model and the extreme gradient lifting tree model are fused through a stacking model fusion method, the support vector machine model is suitable for processing the high latitude of a small sample, the extreme gradient lifting tree model has the advantage of strong fitting capability, and the fused model has the advantages of the support vector machine model and the extreme gradient lifting tree model, so that the model is higher in generalization capability and recognition accuracy, and the time for model training in deep learning is reduced.
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申请号:201910942685.4 公开号:CN110850383A 主分类号:G01S7/41
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.09.30 公开日:2020.02.28
摘要:【中文】本发明属于雷达技术领域,具体涉及一种基于共形阵的MIMO雷达信号处理方法,包括:设置共形阵排列形式,通过共形阵排列形式的发射端发射MIMO信号;根据共形阵排列形式得到若干发射导向矢量和若干接收导向矢量;获取回波信号、若干发射辐射强度和若干接收辐射强度;根据若干接收辐射强度和若干对应接收导向矢量得到若干接收导向矢量对应的接收数字波束形成权值;根据若干对应发射导向矢量得到若干发射导向矢量对应的发射数字波束形成权值;根据MIMO发射信号和若干发射辐射强度得到匹配滤波器权值;根据发射数字波束形成权值和匹配滤波器权值得到脉冲综合系数;根据接收数字波束形成权值和脉冲综合系数得到MIMO信号处理结果。本发明提高了输出信号的信噪比。 【EN】The invention belongs to the technical field of radars, and particularly relates to a MIMO radar signal processing method based on a conformal array, which comprises the following steps: setting a conformal array arrangement form, and transmitting an MIMO signal through a transmitting end of the conformal array arrangement form; obtaining a plurality of transmitting guide vectors and a plurality of receiving guide vectors according to the conformal array arrangement form; acquiring an echo signal, a plurality of emission radiation intensities and a plurality of reception radiation intensities; obtaining a receiving digital beam forming weight corresponding to the receiving guide vectors according to the receiving radiation intensities and the corresponding receiving guide vectors; obtaining a transmitting digital beam forming weight corresponding to the transmitting guide vectors according to the corresponding transmitting guide vectors; obtaining a matched filter weight according to the MIMO transmitting signal and the plurality of transmitting radiation intensities; obtaining a pulse comprehensive coefficient according to the transmitting digital beam forming weight and the matched filter weight; and obtaining an MIMO signal processing result according to the receiving digital beam forming weight and the pulse comprehensive coefficient. The invention improves the signal-to-noise ratio of the output signal.
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申请号:201911073818.5 公开号:CN110855578A 主分类号:H04L12/853
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.11.06 公开日:2020.02.28
摘要:【中文】本发明公开的一种基于相似度的云上微服务资源调度优化方法,主要解决现有方法的系统性能指标不全面、优化时间长且优化效果不佳的问题。其实现方案是:选取微服务基准系统,部署微服务系统;选取微服务环境的资源消耗、抖动程度、关联成本作为优化目标;计算并构建映射据库,并对数据库中的相似结果进行分组;基于当前的工作负载与分组后的映射数据库中各个类别的中心点计算相似度,根据相似度生成初始种群;对该初始种群使用交叉、变异操作进行更新,基于非支配排序对种群进行排序,并选出最优解。实验结果表明,本发明降低了时间成本,提高了微服务系统的性能和资源利用率,可用于对工作负载时刻变化的微服务系统进行动态的资源分配和部署。 【EN】The invention discloses a similarity-based scheduling optimization method for micro-service resources on the cloud, which mainly solves the problems of incomplete system performance indexes, long optimization time and poor optimization effect of the conventional method. The implementation scheme is as follows: selecting a micro-service reference system and deploying the micro-service system; selecting resource consumption, jitter degree and associated cost of the micro-service environment as optimization targets; calculating and constructing a mapping database, and grouping similar results in the database; calculating similarity based on the current working load and the central points of all categories in the grouped mapping database, and generating an initial population according to the similarity; and updating the initial population by using cross and variation operations, sequencing the population based on non-dominated sequencing, and selecting the optimal solution. The experimental result shows that the method reduces the time cost, improves the performance and the resource utilization rate of the micro-service system, and can be used for dynamically allocating and deploying resources of the micro-service system with the working load changing constantly.
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申请号:201911087534.1 公开号:CN110853057A 主分类号:G06T7/11
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.11.08 公开日:2020.02.28
摘要:【中文】本发明公开一种基于全局和多尺度全卷积网络的航拍图像分割方法,其步骤为:构建全局和多尺度全卷积网络;生成训练集;训练全局和多尺度全卷积网络;将待分割的航拍图像输入到训练好的全局和多尺度全卷积网络进行二值分割,生成分割掩码图。本发明利用全局和多尺度全卷积网络对航拍图像进行分割,并在全局和多尺度全卷积网络中嵌入全局模块和多尺度模块,提取更加精细的分割掩码,鲁棒性强,分割精度高。 【EN】The invention discloses an aerial image segmentation method based on global and multi-scale full convolution networks, which comprises the following steps: constructing a global and multi-scale full convolution network; generating a training set; training a global and multi-scale full convolution network; and inputting the aerial image to be segmented into a trained global and multi-scale full convolution network for binary segmentation to generate a segmentation mask image. The method utilizes the global and multi-scale full convolution network to segment the aerial image, and embeds the global module and the multi-scale module in the global and multi-scale full convolution network, thereby extracting more refined segmentation mask, having strong robustness and high segmentation precision.
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申请号:201911177527.0 公开号:CN110854064A 主分类号:H01L21/768
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.11.27 公开日:2020.02.28
摘要:【中文】本发明涉及一种TSV硅通孔和单层RDL再布线一次性整体成型方法,包括如下步骤:步骤1、在硅晶片上进行刻孔;步骤2、在刻孔的内壁上沉积绝缘层;步骤3、在刻孔的内壁的绝缘层上沉积阻挡层;步骤4、在刻孔的内壁的阻挡层上沉积种子层;步骤5、在硅晶片上表面沉积介质层;步骤6、在介质层上刻蚀RDL线槽;步骤7、分别在RDL线槽和刻孔内电镀填充金属;步骤8、减薄硅晶片。该TSV硅通孔和单层RDL再布线一次性整体成型方法,将通孔填充与RDL布线同时进行,使通孔填充与RDL布线接触更加的良好,节省了制备时间以及制备难度。 【EN】The invention relates to a one-time integral forming method for rewiring of a TSV (through silicon via) silicon through hole and a single-layer RDL (radio data link layer), which comprises the following steps of: step 1, etching holes on a silicon wafer; step 2, depositing an insulating layer on the inner wall of the engraved hole; step 3, depositing a barrier layer on the insulating layer on the inner wall of the engraved hole; step 4, depositing a seed layer on the barrier layer on the inner wall of the engraved hole; step 5, depositing a dielectric layer on the upper surface of the silicon wafer; step 6, etching the RDL slot on the dielectric layer; step 7, respectively electroplating filling metal in the RDL wire grooves and the engraved holes; and 8, thinning the silicon wafer. According to the one-time integral forming method for the Through Silicon Via (TSV) and the single-layer RDL rewiring, through hole filling and RDL wiring are carried out simultaneously, so that the through hole filling and the RDL wiring are in good contact, and the preparation time and the preparation difficulty are saved.
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申请号:201911177535.5 公开号:CN110854065A 主分类号:H01L21/768
申请人:【中文】西安电子科技大学【EN】XIDIAN University 申请日:2019.11.27 公开日:2020.02.28
摘要:【中文】本发明涉及一种高深宽比TSV硅通孔的制备方法,包括如下步骤:步骤1、在硅晶片上进行刻孔;步骤2、减薄硅晶片;步骤3、分别从通孔的正反两面进行沉积;步骤4、分别从通孔的正反两面进行金属填充。该高深宽比TSV硅通孔的制备方法,与现有技术将比,在硅晶片上制备通孔后,直接进行减薄处理,然后,从正反两面进行后续的工艺处理,在保证TSV通孔填充的金属均匀的前提下,不仅效率更高,而且能够提高TSV通孔的深宽比,提高线路集成密度,具有更好的填充质量,有利于提高电子器件的集成密度。 【EN】The invention relates to a preparation method of a TSV (through silicon Via) silicon through hole with a high depth-to-width ratio, which comprises the following steps: step 1, etching holes on a silicon wafer; step 2, thinning the silicon wafer; step 3, depositing from the front surface and the back surface of the through hole respectively; and 4, respectively filling metal from the front surface and the back surface of the through hole. Compared with the prior art, the preparation method of the TSV silicon through hole with the high depth-to-width ratio directly thins the silicon wafer after the through hole is prepared, then carries out subsequent process treatment from the front side and the back side, not only has higher efficiency on the premise of ensuring the uniformity of metal filled in the TSV through hole, but also can improve the depth-to-width ratio of the TSV through hole, improves the line integration density, has better filling quality and is beneficial to improving the integration density of electronic devices.
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